-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
IPC Crowns New Hand Soldering Competition World Champion
November 28, 2017 | IPCEstimated reading time: 1 minute

In cooperation with productronica 2017, IPC — Association Connecting Electronics Industries presented its very popular Hand Soldering Competition in Hall A1, stand 307 with a regional competition from November 14–16 and the World Championship on November 17.
In the world championship competition, 16 competitors, representing their countries and companies, came from China, France, Germany, Hungary, India, Korea, Malaysia, Poland, Russia, Thailand, United Kingdom and Vietnam. The competition was vigorous for the grand prize of €1000 and the title of IPC Hand Soldering World Champion.
Taking the title of hand soldering champion was Zhang Yi, China, Chengdu #10 institute with a functional board and score of 473 out of a possible 500. Second place went to Vu Thi Xuan, Vietnam, 2 UMC, with a functional board and score of 458; and third place went to Hasrol Mizom Hosson, Malaysia.
“The world championship hand soldering competition, required the competitors to hone their best skills and focus on a very complex board,” said Kris Roberson, IPC director of certification. “Of the 16 competitors only six completed a functional board to give you an idea of how difficult the board design was. Normally, the competitors are given 60 minutes to complete the board, for the championship round the time limit was 75 minutes,” Roberson added.
Assemblies were judged on soldering in accordance with IPC-A-610F Class 3 criteria, the speed at which the assembly was produced and overall electrical functionality of the assembly. IPC-A-610 Master Instructors from IPC licensed master training centers served as the judges. The MIT judges were from China, Estonia, France, Holland and the United States.
“The best-of-the-best hand soldering talent came from around the globe to compete for the world championship being held for the first time at productronica,” said David Bergman, IPC vice president of standards and training. “The competition was tough and each competitor rose to the challenge. We look forward to hosting these popular hand soldering competitions across the globe in 2018.”
IPC would like to thank Hand Soldering Competition Gold Sponsors: JBC Tools, Kurtz Ersa, Weller; Silver Sponsors: Almit GmbH, Balver Zinn GmbH, and NCAB Group; Bronze Sponsors: IFTEC, PIEK International Education Centre, Optilia, MicroCare, ULT, LICO, MicroCare and Weidinger; and contest Contributor Sponsors: Microsolder, and RONDO for their support.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Building Electronics Excellence in India
09/08/2025 | Nolan Johnson, SMT007 MagazineFor over two decades, Dave Bergman has helped steer the Global Electronics Association’s work in India, from a single training course to a thriving regional operation with deep government and industry ties. In this interview, Dave explains how the group went from partnering with IPCA to opening its own office in 2010, creating India’s first domestic electronics manufacturing standard, and securing funding for dozens of Indian companies to attend U.S. trade shows.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/08/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
The Global Electronics Association Hosts Successful WorksAsia-AI and Factory of the Future Technical Seminar
09/03/2025 | Global Electronics AssociationOn August 22, 2025, the Global Electronics Association hosted the successful WorksAsia-AI and Factory of the Future Technical Seminar during the exhibition Automation Taipei 2025. The seminar brought together 81 representatives from 58 companies, focusing on the latest applications of AI in smart factories and unveiling four key directions that will drive the electronics industry’s transition toward intelligence and sustainability.
TRI's AI-Powered Inspection Solutions at SMTAI 2025
09/02/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems, will be joining the SMTA International Exposition & Conference. The event will be held from October 21 – 23, 2025, at the Donald E. Stephens Convention Center in Rosemont, IL, USA.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.