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Base Material Properties and Microvia Reliability

07/01/2026 | Ed Kelley, Victory Giant Technology
The drive toward higher circuit density is challenging PCB manufacturers and their supply chains alike, with base materials as a critical foundation for complex designs. HDI designs present specific challenges and requirements for these materials, but given the myriad possible designs and applications, there is no optimal “one size fits all” material. Perhaps the most challenging HDI designs are those that use stacked vs. staggered microvias, with the number of layers of stacked microvias and the pitch between them as critical variables.

Learning With Leo: Soldering—The Interpretation Problem

06/30/2026 | Leo Lambert -- Column: Learning With Leo
At EPTAC, we operate the largest electronics training facility in the United States, and that gives us a vantage point few others have. I’ve spent most of my career on the training floor and in the rooms where IPC standards get written and revised. Every week, engineers, operators, inspectors, and quality teams come to us from across the country and across industries for help, and they bring their toughest questions. On the surface, they’re asking about toe fillets, gold plating, or rework limits. But underneath those questions is something more important: uncertainty about reliability.

Apple Adopts Next-Gen OLED Display Color Standard

06/29/2026 | TrendForce
TrendForce's latest AMOLED technology and market report reveals that Apple plans to gradually adopt OLED panels capable of achieving 95% coverage of the BT.2020 color gamut across future MacBook Pro, iPad Pro, and iMac product lines.

Right-sizing Silver: An Application-driven Approach to Engineering Reliability

06/24/2026 | Ebad Rehman, MacDermid Alpha Electronics Solutions
Rising cost pressure and metals market uncertainty are prompting manufacturers to rethink alloy composition to balance total cost of ownership, process yield, and mechanical performance. Solder alloy selection directly influences cost structure, process stability, and long‑term reliability in electronics assembly. As manufacturing scales and product requirements advance, these decisions are increasingly revisited with a more focused objective: aligning materials with how products are built, processed, and used in real‑world conditions.

Knocking Down the Bone Pile: The Business Case for Component Reclamation

06/23/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Electronic waste is increasing globally at an alarming rate. By 2030, it is estimated that the world will generate approximately 82 million tons of electronic waste per year. Rapid technological advances, shorter product lifecycles, and supply chain disruptions often lead manufacturers to build bloated inventories of electronic products. Unfortunately, some of this inventory ends up as electronic waste when components become obsolete or surplus to forecasted requirements, including high-value devices.
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