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Engineered Material Systems Intros Low-Temp Cure Conductive Adhesive
December 4, 2017 | Engineered Material SystemsEstimated reading time: Less than a minute
Engineered Material Systems' newly launched CA-183 low-temperature cure electrically conductive adhesive is designed for die attach and general circuit assembly applications.
The CA-183 cures in 60 minutes at 80°C, 20 minutes at 100°C, or 30 seconds at 150°C, and has an electrical conductivity of 9 x 10-4 ohm-cm. This material is ideal for applications where the components are temperature sensitive and require high conductivity interconnects. CA-183 has a 48-hour work-life and a 26,000 cP viscosity at 5rpm for easy needle dispensing or application by pin transfer.
The adhesive was developed to pass the rigorous reliability requirements in die attach, disk drive, camera module, photonics and circuit assembly applications. CA-183 is the latest addition to Engineered Material Systems extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.
About Engineered Material Systems
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, click here.
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