Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Indium, SMT Thermal Tech to Demonstrate Low-Temp Reflow Energy Savings

10/05/2026 | Indium Corporation
Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will explore how combining innovative solder materials with optimized reflow oven technology can reduce energy consumption at the Expo for Electronics Manufacturing (EFX), October 6-8, in Stuttgart, Germany.

Indium Experts to Present Advanced Packaging, AI, and High-Performance Computing Materials Solutions at IMAPS Symposium

09/28/2026 | Indium Corporation
As a leading provider of high-reliability, AI-enabling soldering materials, three Indium Corporation experts will share new research and insights on addressing advanced packaging and high-power performance challenges at the IMAPS Symposium 2026, September 29-October 1, in Boston, Massachusetts.

Mexico Solders On With Indium Corporation

09/16/2026 | Nolan Johnson, SMT007 Magazine
It makes sense to go where the customers are, which is why Indium Corporation recently opened a new solder paste manufacturing facility in Guadalajara, Mexico. Chris Bastecki, vice president of the Americas Sales and Service Group at Indium Corporation, as well as vice president of PCB Assembly Materials, discusses the reasons behind the new facility, the growing market segments, and the challenges of matching solder to specific applications.

Indium Promotes Chris Bastecki to Business Unit Vice President

09/11/2026 | Indium Corporation
Indium Corporation is pleased to announce the promotion of Chris Bastecki to Business Unit Vice President, Americas Sales & Service and Global Printed Circuit Board (PCB) Assembly Materials Marketing.

Indium Promotes Damian Santhanasamy to Global Accounts Manager

09/09/2026 | Indium Corporation
With its commitment to innovation and growth through employee development, Indium Corporation® is pleased to announce the promotion of Damian Santhanasamy to Global Accounts Manager.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in