Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Ersa Names New Managing Director
December 19, 2017 | Kurtz Ersa Corp.Estimated reading time: 1 minute
Ersa GmbH has strengthened its management team with the appointment of Ralph Knecht as the managing director of Ersa, effective October 1, 2017.
Knecht joins Ersa from Schlafhorst, a global provider of spinning frame and textile machinery, wherein he has been responsible for various business units. He will take over from Rainer Kurtz, who has been the sole managing director of Ersa GmbH since 1993. Kurtz will be leaving the company on January 1, 2018.
Since 2003, Kurtz has also been the Chairman of the Managing Board of the Kurtz Ersa Group. Moving forward, Kurtz will focus on the management and strategic expansion of the Kurtz Ersa Group, wherein he will still be responsible for the Electronics Production Equipment segment. Apart from Ersa GmbH, this also includes the strongly growing production of soldering machines in Zhuhai, China, as well as the global sales and service activities of the business unit.
About Kurtz Ersa Group
Innovation is based on experience and history at the Kurtz Ersa corporation. Since 1779 they have been implementing many decisive technical innovations - and for just as long have been cultivating enduring customer relations based on true partnership. Today, with more than 80 experienced engineers and technicians worki on new innovations and improvements every day. With headquarters based in Wertheim Germany, the Kurtz Ersa corporation is already technology respectively world market leader in many of its business areas.
Share on:
Suggested Items
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.
SMTA Bridging the Skills Gap in Arizona
04/24/2025 | Marcy LaRont, I-Connect007One area where SMTA really excels is through its local chapters. On April 16, 2025, I-Connect007's Marcy LaRont attended the Workforce Breakfast during the SMTA Arizona Expo & Tech Forum in Mesa, which featured more than 50 electronics professionals from the local area, including defense OEMs, and others who were attending for the first time. Blackfox and Hyrel Technologies sponsored the event. The keynote presentation featured Sean Denny, a professor at Estrella Mountain Community College, who emphasized a clear need for skilled hand soldering technicians.
IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data
04/23/2025 | IPCIPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.