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Top 10 Most-Read SMT News Stories of 2017
December 29, 2017 | I-Connect007Estimated reading time: 2 minutes
As the year comes to a close, the editors at I-Connect007 have pulled together a list of the top 10 news stories from the pages of SMT007. Enjoy this list of the most-read news highlights of 2017.
1. IPC Volunteers Honored for Contributions to Electronics Industry at IPC APEX EXPO
IPC – Association Connecting Electronics Industries presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
2. Jabil to Manufacture Innoviz Technologies' After-Market LiDAR System
Innoviz Technologies, a provider of LiDAR intelligent sensing solutions designed for the mass commercialization of autonomous vehicles, today announced the development of InnovizPro, an after-market LiDAR solution designed for testing and R&D of autonomous driving technology.
3. Seica to Exhibit at productronica
Seica S.p.A. will be showcasing its latest testing solutions at productronica 2017.
4. IPC APEX EXPO 2017 Coverage with I-Connect007
Didn't make it to IPC APEX EXPO 2017? We've got it covered for you. We at I-Connect007 featured a state-of-the art micro studio, where over 70 RealTimewith…IPC interviews were conducted. Get all of your post-show coverage, including in-depth interviews and the event photo gallery, by visiting our RealTimewith…IPC APEX EXPO 2017 site now!
5. Flex Announces 2017 Preferred Supplier Award Recipients
EMS firm Flex recently honored the recipients of its 2017 Preferred Supplier Awards at this year’s Global Supplier Summit, hosted at the Flex Customer Innovation Center, in the heart of the Silicon Valley.
6. TRI to Showcase PCBA Inspection Solutions at NEPCON Japan 2018
Test Research Inc. (TRI) will join NEPCON Japan 2018, which will be held at the Tokyo Big Sight, to showcase its Industry 4.0 Inspection solution, YMS 4.0, along with its complete PCBA manufacturing inspection solutions.
7. Dymax's Dr. Nebioglu Presented Research at IPC APEX Expo
Dymax Corporation is proud of the participation of its Senior R&D Manager of the Adhesives team, Dr. Aysegul Kascatan Nebioglu at the IPC/ APEX Expo 2017 that took place on February 14 to 17 in San Diego, California.
8. Sparton and Ultra Electronics JV Inks $30.3M US Navy Sonobuoy Contract
Sparton Corp. and Ultra Electronics Holdings plc have been awarded subcontracts valued at $30.3 million to their ERAPSCO joint venture, for the manufacture of sonobuoys for the United States Navy.
9. IPC APEX EXPO 2018 Educational Programs Highlight Tech’s Accelerating Speed of Change
Changing technologies that are driving the electronics industry will take center stage throughout the IPC APEX EXPO 2018 technical conference and professional development sessions, which will take place February 24 - March 1 at the San Diego Convention Center in San Diego, California.
10. Nordson to Retain ACE Manufacturing, Service and Support in Spokane
ACE Production Technologies, Inc. is pleased to announce that Nordson Corporation has acquired ACE Production Technologies, Inc.
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.