-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Focus on the New
January 5, 2018 | Stephen Las Marias, I-Connect007Estimated reading time: 1 minute
Hello, 2018! Wow, it seems like it wasn’t too long ago when I was writing about the optimism of the electronics manufacturing and assembly industry going into 2017. Now, here we are again at the beginning of the new year, looking at new trends, disruptive technologies, and emerging markets for 2018.
First things first!
I am sure you have noticed our name has changed from SMT Magazine to SMT007 Magazine. Not only did we update our magazine’s name, we also refreshed the interior pages of the publication, as well. As an I-Connect007 publication, SMT007 Magazine fits nicely with our other publications, which also carry through with the naming convention starting this month: PCB007 Magazine and Design007 Magazine. We hope you enjoy this fresh new look.
What else have we been up to?
Last month, our team attended the HKPCA & IPC Show in Shenzhen, China, to talk to industry leaders in the PCB supply chain about trends and technologies to watch for in the coming year.
The consensus is that everyone’s excited about the continuing growth in the electronics assembly industry. Last year, the industry was beset with the copper foil shortage. While the same shortage can be expected this year, given the strong growth of the automotive electronics industry, manufacturers and suppliers remain bullish that this same growth will fuel other aspects of the electronics manufacturing industry.
Show attendees and vendors were also generally excited about 5G, highlighting the pilot deployment of the first 5G network at the 2018 Winter Olympics in South Korea. Other notable technologies with expected growth include medical electronics, and the proliferation of devices for the Internet of Things (IoT).
This Month’s Lineup
In this issue, we have taken a close look at the many facets and considerations associated with investing in new equipment. Do you buy new equipment just to say you have the latest systems in your processing lines? Of course not. But what are the key reasons that will drive you to invest in new equipment, and what decision process goes on behind the scenes that justifies your investment in these new machines?
To read the full version of this article, which appeared in the January 2018 issue of SMT007 Magazine, click here.
Suggested Items
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
12/16/2024 | SCHMID GroupThe SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space
12/12/2024 | BUSINESS WIREThe OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multilayer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB. The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB. OTC is working to develop mass-production technologies with the aim of introducing PCBs incorporating this new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.
Fresh PCB Concepts: PCB Plating Process Overview
12/12/2024 | Team NCAB -- Column: Fresh PCB ConceptsIn this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.