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Ventec Highlights Advanced Ultra-Low Dk PCB Materials at DesignCon 2018
January 8, 2018 | Ventec InternationalEstimated reading time: 1 minute
Ventec International will showcase its extensive range of tec-speed materials for high-speed low-loss applications including the latest tec-speed 10 ultra-low dk material at DesignCon 2018 show in Santa Clara, California, USA from 30 January to 1 February in booth #118. A further highlight will be a next generation best-in-class, thermally conductive (8 X FR-4) high Tg thin-core and prepreg material (VT-5A2) ideal for hybrid multilayer low-loss constructions.
Ventec will be exhibiting at DesignCon 2018, the premier conference for chip, board, and systems design engineers, on booth #118 highlighting it’s tec-speed range of PCB materials for high-speed low-loss applications. By using an ultra-low Dk material with Dk values between 2.3 and 2.8 lower losses, lower system power requirements and with it the delicate balance of performance and cost can be achieved. Higher layer counts on backplanes, daughter cards and hand-held's are made possible in a smaller footprint by having smaller layer to layer separation without sacrificing trace width.
“Maintaining wider traces produces lower resistance in the signal path," said Martin Cotton, Director of OEM Technology Marketing. "Combining ultra-low Dk with a low Df of 0.003 to 0.004, produces an alternative to ever smaller traces and higher power requirements."
Ventec’s highest performance thermally conductive laminate material so far will also make its DesignCon debut. VT-5A2 offers a polymer matrix that is fully compatible with Ventec laminates, epoxy or polyimide based materials including tec-speed, making it the ideal choice for the manufacture of hybrid multilayer low-loss constructions.
Cotton and Peter Koolen, Global Account Manager for OEM Technology Marketing, will be on hand to offer technical advice.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
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