Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Nordson ASYMTEK Acquires Infiniti Dosing Product Lines
January 8, 2018 | Nordson ASYMTEKEstimated reading time: 1 minute
Nordson ASYMTEK, a Nordson company and global leader in dispensing, jetting, and coating equipment and technologies, has acquired the rights and assets to progressive cavity pump (PCP) product lines from Infiniti Dosing o.m.s. The transaction, which closed on January 5, 2018, provides Nordson ASYMTEK with dispensing and dosing products marketed by Infiniti under the Dot Streamer (DS) and Accura brands. Infiniti's owner and founder, Jean-Claude Tytgat, will join Nordson ASYMTEK and continue to work on technology developments.
"We are pleased to add Infiniti progressive cavity pump technology to our portfolio of fluid delivery systems for electronics manufacturing and are thrilled to have Mr. Tytgat join our team," stated Peter Bierhuis, president, Nordson ASYMTEK. "The technology complements Nordson ASYMTEK's industry-leading jetting technology and adds capabilities for high-quality micro-dispensing of a large variety of materials. Mr. Tytgat's product development skills will ensure continued innovation."
Infiniti Dosing products deliver highly viscous and abrasive fluids in mini and micro levels for electronics applications. Materials dispensed include silicones, MS polymers, solder pastes, MMAs, epoxy resins, potting compounds, sealants, and 2-component, thermally conductive, and electrically conductive adhesives.
"Joining Nordson ASYMTEK is the perfect synergy for Infiniti," said Mr. Tytgat. "Their global infrastructure and deep technical competence will speed the growth and adoption of the micro-dispense capabilities that our PCP technology offers."
About Nordson ASYMTEK
Nordson ASYMTEK, a world leader in precision fluid dispensing, conformal coating, and jetting technologies, designs and manufactures dispensing and coating systems, supported by an award-winning global applications and service network for over 30 years. To find out more here.
About Nordson Corporation
Nordson Corporation delivers precision technology solutions that help customers succeed worldwide. Precision dispensing of adhesives, coatings, sealants, biomaterials, and other fluids, plastic extrusion and injection molding, electronics testing and inspecting, and surface preparation are supported by applications expertise and direct global support. Nordson serves consumer non-durable, durable and high-technology markets, specializing in packaging, nonwovens, electronics, medical, energy, transportation, construction, and product assembly. Founded in 1954, headquartered in Westlake, Ohio, USA, Nordson has operations and support offices in 30+ countries. Connect with Nordson here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.