Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Free UV Curing Guide Offers Top Tips from Intertronics
January 9, 2018 | IntertronicsEstimated reading time: 1 minute
The curing of materials like adhesives, coating, encapsulants, potting compounds, temporary masking materials or gaskets with UV light offers many process advantages, and can deliver productivity enhancements to manufacturers. The ability of the technology to deliver full cure in seconds (rather than minutes or hours) is a prime example.
The materials are predominantly single part (no mixing) and only cure on demand, so application or dispensing is straightforward and readily automatable. The light curing process looks quite simple, and indeed it is. But like most things, there is a learning curve.
The latest publication from Intertronics, "Top Tips for Getting the Best from your UV Curing Process," breaks down the elements of this technology. The aim is to give a better understanding of the way that UV curing works and to discuss the process variables. A good grasp of the fundamentals will help engineers, technicians and operators to set up an established process which is effective, robust and repeatable. Along the way, there are some rules of thumb and tricks of the trade to make things easier and to ensure success.
The free guide discusses some of the differences between conventional UV curing lamps and the latest lamps based on LED technology.
For more information, click here.
Share on:
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).