-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
MacDermid Enthone Electronics Solutions to Exhibit at 2018 IMAPS Device Packaging Show
January 29, 2018 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions (MEES), a global electronics chemicals supplier, will exhibit at the IMAPS Device Packaging show being held in Fountain Hills, Arizona, March 6-7, 2018.
MacDermid Enthone‘s Advanced Electronics Solutions (AES) business is a global leader in high performance semiconductor chemistries and assembly materials. OEMs, IDMs, wafer foundry engineers, tool suppliers, and OSATs should visit the IMAPS booth to collaboratively develop solutions that meet the fast paced semiconductor market demands. The AES team will highlight the MICROFAB family of products which provides advanced packaging solutions that exceed aggressive packaging design requirements and enable greater device reliability. MEES will showcase its chemical processes for IC substrates, including PackagePrep solderable finish for QFN sidewalls, and PackageBond leadframe adhesion promoter.
Eric Gongora, General Manager and Stretegic Marketing Director of Wafer Level Packaging, along with AES industry experts, will be available to discuss the challenges the semiconductor manufacturing sector faces as technology continues to push the limits of performance and miniaturization.
The booth will also include specialty product offerings from their sister company, Alpha Advanced Materials. The combined technology, experience and product offerings make them the new industry leader in all materials for Advanced Packaging.
For more information on our latest product technologies, visit us at Booth 45/46.
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. For more information, click here.
Suggested Items
Incap Estonia Recognized with Second Golden Label for Responsible Business
06/27/2025 | IncapIncap Electronics Estonia has been awarded a golden label by the Responsible Business Forum in Estonia for the second time. The responsible business label is a prestigious symbol in Estonia that identifies entrepreneurs and organisations that demonstrate excellence in environmental, social, and economic responsibility.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.
TT Electronics Achieves ISO 13485 Medical Certification at Mexicali EMS Facility
06/27/2025 | TT ElectronicsThis milestone underscores TT Electronics’ commitment to delivering high-quality, compliant, and reliable manufacturing solutions to its global customers in healthcare and life sciences.
PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025
06/27/2025 | PRNewswireThe Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.
Scanfil Strengthens its Customer Portfolio in Medtech & Life Science by Signing Agreement with Liquid Instruments
06/27/2025 | BUSINESS WIREScanfil and Liquid Instruments have signed a manufacturing outsourcing agreement for Scanfil’s Melbourne plant in Australia. This agreement supports Liquid Instruments’ strategy to onshore production of its flagship Moku platform, strengthening domestic supply chains and bringing manufacturing closer to its research and development hub.