KAIST Team Develops Flexible Vertical Micro LED
January 30, 2018 | KAISTEstimated reading time: 1 minute
A KAIST research team led by Professor Keon Jae Lee from the Department of Materials Science and Engineering and Professor Daesoo Kim from the Department of Biological Sciences has developed flexible vertical micro LEDs (f-VLEDs) using anisotropic conductive film (ACF)-based transfer and interconnection technology. The team also succeeded in controlling animal behavior via optogenetic stimulation of the f-VLEDs.
Flexible micro LEDs have become a strong candidate for the next-generation display due to their ultra-low power consumption, fast response speed, and excellent flexibility. However, the previous micro LED technology had critical issues such as poor device efficiency, low thermal reliability, and the lack of interconnection technology for high-resolution micro LED displays.
The research team has designed new transfer equipment and fabricated a f-VLED array (50ⅹ50) using simultaneous transfer and interconnection through the precise alignment of ACF bonding process. These f-VLEDs (thickness: 5 ㎛, size: below 80 ㎛) achieved optical power density (30 mW/mm2) three times higher than that of lateral micro LEDs, improving thermal reliability and lifetime by reducing heat generation within the thin film LEDs.
In this work, they inserted the innovative f-VLEDs into the narrow space between the skull and the brain surface and succeeded in controlling mouse behavior by illuminating motor neurons on two-dimensional cortical areas located deep below the brain surface.
Professor Lee said, “The flexible vertical micro LED can be used in low-power smart watches, mobile displays, and wearable lighting. In addition, these flexible optoelectronic devices are suitable for biomedical applications such as brain science, phototherapeutic treatment, and contact lens biosensors.”
Suggested Items
Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America
05/20/2025 | Deca TechnologiesDeca Technologies announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced packaging facility in Bromont, Quebec.
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
05/20/2025 | Jerome Larez -- Column: Global PCB ConnectionsIn the past decade, flex and rigid-flex PCB technology has become the fastest-growing market segment. As an increasing number of PCB companies develop the capabilities to fabricate this technology, PCB designers are becoming comfortable incorporating these designs into their products.
Global PCB Market Forecast to Reach $86.5 Billion by 2029 with 5.9% Annual Growth
05/19/2025 | EINPresswire.comThe printed circuit board market size has witnessed steady growth in recent years and the trend is anticipated to continue. Increasing from $65.82 billion in 2024 to $68.75 billion in 2025, it showcases a compound annual growth rate CAGR of 4.5%.
Seoul Semiconductor, Seoul City Join Forces to Enhance Public Safety
05/19/2025 | BUSINESS WIRESeoul Semiconductor Co., Ltd.a leading global innovator of LED products and technology, announced that it has signed a “Standard Safety Design Agreement” with the Seoul Metropolitan Government to enhance citizen safety in tunnels and underpasses throughout the city.
Connection Wins Intel Partner of the Year Award for AI PC
05/16/2025 | BUSINESS WIREConnection, a leading information technology solutions provider to business, government, healthcare, and education markets, is pleased to announce that it has received Intel’s 2025 Partner of the Year award for AI PC. Connection earned this distinction for demonstrating exceptional technology innovation and collaboration in developing solutions and marketing strategies.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in