Mek to Showcase Full Metrological 3D AOI at IPC APEX EXPO 2018

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Mek (Marantz Electronics) will showcase a comprehensive range of AOI systems at this year’s IPC APEX EXPO, featuring the latest in 3D inspection technology. The Mek team will be on hand at Booth 1707 to host demonstrations of unique AOI capability across a very wide range of applications and budgets.

IPC APEX EXPO will represent the Americas launch of Mek’s new flagship 3D AOI system ISO-Spector M1A. The ISO-Spector is the industry’s most advanced high-speed 3D SMT solder joints and components AOI and introduces an exceptionally convenient fast automatic programming method while achieving production ready inspection results with very short cycle times. Carrying the industry’s largest, 25 mega pixel sensor and 69 x 69mm FoV the M1 delivers ultra-high speed inspection of even 008004 components, leads and solder joints. Multiple Moiré fringe projections enable high precision, shadow free measurement of heights up to 30 mm as well as 4 fully programmable side view high-res cameras able to actively inspect J- leads and other devices invisible to top side imagers.

The Artificial Intelligence of the system learns the production process values of assembled and reflowed PCB’s then recognizes defects determined by hundreds of preset parameters based on CAD and Gerber data. This applies especially to solder joints, which are typically the most difficult and time consuming to program in AOI’s

Another product highlight at the show includes the SpectorBOX GTAz 550. This “Bottom Up/Top Down” system is uniquely engineered to accommodate solder frames on return and/or feed conveyors. SpectorBOX offers bottom side, top side or simultaneous dual side inspection, deploying up to 18 cameras, Z axis positioning and auto-focus.  The design is optimized for the inspection of THT components to identify defects such as presence/absence, wrong polarity, colour, type, and bent pins. Various integration alternatives are greatly enhanced by its slim, compact mechanical design.

Mek offers a complete line of inspection equipment for maximized defects coverage, with minimum human interaction, at the lowest cost. The new entry level iSpector JDz 520 boasts high specifications, including a 5 mega pixel camera, 15 micron telecentric lens, Co-Axial light and 520 x 460mm max. PCB size.  This bench top powerhouse uses same high speed programming software as the PowerSpector series of machines.

Simultaneous 3D and 2D (5D) Solder Paste Inspection on the ISO-Spector S2 is made possible with patented, third generation sensor technology. Shadow free violet/blue dual lasers ensure accurate and repeatable 3D measurements while episcopic and low angle diffuse RGB lighting creates the highest quality of 2D colour imaging available today.

Mek SpiderEye Machine Vision systems are static AOI machines for the inspection of moving objects. Inspection and quality control tasks traditionally performed by humans or inflexible mechanical procedures can be fully automated for increased throughput, lower defect counts and to generally boost productivity and profitability. This another unique machine vision solution, including powerful algorithms for THT solder joint inspection with meniscus profiling, and myriad integration alternatives.

About Mek (Marantz Electronics Ltd)

A former division of Marantz well known for its high quality Audio/Video products, Mek Japan (Marantz Electronics Kabushiki Kaisha), developed its first AOI system in 1994. Developed to inspect PCB assemblies for correct component placement and soldering, the company’s original AOI system was designed for use in Marantz factories. Proving to be a highly successful, cost-effective alternative to traditional human inspection, Mek developed its first generation commercial system in 1996. With a steadily growing installed base, MEK Japan and its European/American headquarters, Mek, have sold over 7000 units worldwide to date. Now well established as a leading force in AOI technologies, the company also manufactures a 5D post-print SPI system which combines 3D and 2D image processing methodologies to deliver unprecedented defect detection. At the beginning of March 2014 the company opened US offices in Las Vegas.