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IWLPC Technical Committee Announces Best Presentation & Papers Awards for 2017
February 2, 2018 | IWLPCEstimated reading time: Less than a minute
The IWLPC Technical Committee is pleased to announce the Best of Conference, Best Presentation & Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks as chosen by the technical committee and attendees based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation.
Best of Conference Presentation - Guilian Gao, Ph.D., XPERI/Invensas
"Development of Hybrid Bond Interconnect Technology for Die-To-Wafer and Die-to-Die Applications"
Best of Conference Paper - Wolfram Steller, Ph.D., Fraunhofer IZM AAID
"Dual Side Chip Cooling Realized by Microfluidic Interposer Processing on 300mm Wafer Diameter"
Best of 3D Track Paper - Wolfram Steller, Ph.D., Fraunhofer IZM AAID
"Dual Side Chip Cooling Realized by Microfluidic Interposer Processing on 300mm Wafer Diameter"
Best of WLP Track Paper - Tanja Braun, Ph.D., Fraunhofer IZM
"Fan-Out Wafer and Panel Level Technology for Advanced LED Packaging"
Best of Advanced Manufacturing and Test Track Paper - Paul Werbaneth, Intevac, Inc.
"Process and Productivity Results from a Carrier-Based Linear Transport PVD Systems for RDL Seed Layer Deposition in Fan-Out Packaging Applications"
About IWLPC
IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV and integrated system packaging.
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