Nolan’s Notes: Everyone Has Their Eye on India
Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
IWLPC Technical Committee Announces Best Presentation & Papers Awards for 2017
February 2, 2018 | IWLPCEstimated reading time: Less than a minute
The IWLPC Technical Committee is pleased to announce the Best of Conference, Best Presentation & Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks as chosen by the technical committee and attendees based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation.
Best of Conference Presentation - Guilian Gao, Ph.D., XPERI/Invensas
"Development of Hybrid Bond Interconnect Technology for Die-To-Wafer and Die-to-Die Applications"
Best of Conference Paper - Wolfram Steller, Ph.D., Fraunhofer IZM AAID
"Dual Side Chip Cooling Realized by Microfluidic Interposer Processing on 300mm Wafer Diameter"
Best of 3D Track Paper - Wolfram Steller, Ph.D., Fraunhofer IZM AAID
"Dual Side Chip Cooling Realized by Microfluidic Interposer Processing on 300mm Wafer Diameter"
Best of WLP Track Paper - Tanja Braun, Ph.D., Fraunhofer IZM
"Fan-Out Wafer and Panel Level Technology for Advanced LED Packaging"
Best of Advanced Manufacturing and Test Track Paper - Paul Werbaneth, Intevac, Inc.
"Process and Productivity Results from a Carrier-Based Linear Transport PVD Systems for RDL Seed Layer Deposition in Fan-Out Packaging Applications"
About IWLPC
IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV and integrated system packaging.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
The Knowledge Base: Cultivating Your Brand in the Age of Connection
08/19/2025 | Mike Konrad -- Column: The Knowledge BaseAudiences have evolved in how they consume information, form opinions, and make purchasing decisions. While marketing still relies on tried-and-true methods—get your name and message in front of your audience—you must also cultivate connection, credibility, and community. Your customers, particularly the younger generation of engineers, buyers, and program managers, want to discover value on their terms.
Automated Production Equipment and Manncorp Announce Strategic Partnership to Expand SMT Solutions for U.S. Electronics Manufacturers
08/06/2025 | Automated Production EquipmentAutomated Production Equipment (APE), a trusted supplier of high-performance soldering and rework systems, proudly announces a strategic partnership with Manncorp, a leading provider of Surface Mount Technology (SMT) production equipment. This collaboration brings together two industry leaders to deliver expanded, end-to-end SMT solutions to electronics manufacturers across North America.
Indium Corporation Promotes Two Leaders in EMEA (Europe, Middle East, and Africa) Markets
08/05/2025 | Indium CorporationWith its commitment to innovation and growth through employee development, Indium Corporation today announced the promotions of Andy Seager to Associate Director, Continental Sales (EMEA), and Karthik Vijay to Senior Technical Manager (EMEA). These advancements reflect their contributions to the company’s continued innovative efforts with customers across Europe, the Middle East, and Africa (EMEA).
Dan’s Biz Bookshelf: ‘In Defense of a Liberal Education’
07/31/2025 | Dan Beaulieu -- Column: Dan's Biz BookshelfWhile Fareed Zakaria’s "In Defense of a Liberal Education" isn’t technically a business book, it’s nevertheless one that any business leader developing a workforce should read. A powerful, thought-provoking treatise on why the liberal arts are crucial, "Liberal Education" challenges the growing emphasis on STEM (science, technology, engineering, and math) education at the expense of broader intellectual pursuits.