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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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iNEMI Releases Schedule of Q1 and Q2 Events
February 2, 2018 | iNEMIEstimated reading time: Less than a minute
Important collaborative meetings, webinars, and panel discussions are already underway for 2018 at iNEMI. At the top of the year, iNEMI is inviting you to mark your calendars now to know the latest happenings you won't want to miss.
iNEMI presentation at EIPC 2018 Winter Conference: February 2; Lyon, France
SMTA Pan Pacific Microelectronics Symposium: February 5-8; Big Island, Hawaii
Roadmap workshop at APEX: February 25-26; San Diego, California
iNEMI / AIM Academy Meetings at OFC 2018: March 12; San Diego, California
iNEMI panel session at Microtech 2018: April 10; Egham, UK
iNEMI Session at ICEP-IAAC 2018: April 19; Kuwana, Mie, Japan
iNEMI Workshop at Electronics in Harsh Environments Conference (SMTA Europe): April 26; Amsterdam
NEPCON CHINA 2018: April 24-26; Shanghai, China
Medical Electronics Symposium: May 16-17; Richardson (Dallas), Texas
Roadmap workshop at ECTC: May 28; San Diego, CA
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Marcy’s Musings: Countdown—The Fabricator’s Guide to IPC APEX EXPO
02/18/2024 | Marcy LaRont -- Column: Marcy's MusingsLike any great tech industry event, IPC APEX EXPO pushes us out of our busy 24/7 manufacturing bubbles. It forces us to pay attention to things that are important but not always present in our day-to-day lives. But there is so much to see and do. This issue of PCB007 Magazine previews many of the important events taking place at the show this year and highlights some changes and opportunities. Let us help you map out your show plan. This issue is focused on the PCB fabricator’s show experience and how you can get the most from your valuable time and investment in attending the show. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Averatek to Present 'Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs' at IPC APEX EXPO
10/29/2021 | AveratekAveratek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, “Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs” during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California.
IPC APEX EXPO 2022 Attendees Can Achieve Digital Transcendence at Show Networking Events
10/13/2021 | IPCIPC APEX EXPO 2022 attendees can meet with electronics industry innovators and connect with peers all in one place at the San Diego Convention Center, January 22–27, 2022.
Foundations of the Future: IPC Education Foundation Lessons Learned
06/29/2021 | IPC Education Foundation -- Column: Foundations of the FutureLooking back on our second year, the IPC Education Foundation (IPCEF) takes pride in how we how we adjusted our engagement initiatives during the pandemic. We couldn’t rely on our original strategy of hosting and attending a range of in-person activities and events.
Dave Bergman on IPC and CFX
07/03/2018 | Barry Matties, I-Connect007The recent SMT Hybrid Packaging show in Nuremberg, Germany, marked the second opportunity for IPC to showcase its new Connected Factory Exchange (CFX) initiative. In this interview, David Bergman, VP for international relations at IPC, tells us more on the overall reception of CFX and the benefits users are seeing thus far. He also provides an update on what’s next for the open source standard.