Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Seika Machinery to Highlight Latest Cabinet at IPC APEX EXPO 2018
February 5, 2018 | Seika Machinery, Inc.Estimated reading time: 1 minute
Seika Machinery Inc. will introduce its new McDry DXU-1001A UL, Quick Dehumidifying Model, with DicksonOne Data Logger, at the IPC APEX EXPO 2018, scheduled to take place February 27−March 1, 2018 at the San Diego Convention Center in California. Company representatives will show the system with the DicksonOne Data Logger for the first time in Booth 2043.
McDry cabinets can be monitored safely and effectively with the DicksonOne data loggers. Features of the DicksonOne include cloud-based, security data storage, multiple unit monitoring, multiple sample rates, and email, phone and text alerts.
The new McDry DXU-1001A high performance dry cabinet maintains one percent RH levels and quickly recovers back to set point 2−3 times faster than previous model. All McDry ultra-low humidity storage cabinets conform to IPC/JEDEC J-STD 033C and IPC 1601 Standards. Additionally, the ESD safe design adheres to the IEC-61340-5-1 (ESD) Standard. McDry cabinets dehumidify ICs to prevent micro-cracking and are an alternative to baking, MBBs and nitrogen storage.
For more information about the system or Seika’s complete product line, visit www.seikausa.com.
About Seika Machinery
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.
Share on:
Suggested Items
Marcy’s Musings: Countdown—The Fabricator’s Guide to IPC APEX EXPO
02/18/2024 | Marcy LaRont -- Column: Marcy's MusingsLike any great tech industry event, IPC APEX EXPO pushes us out of our busy 24/7 manufacturing bubbles. It forces us to pay attention to things that are important but not always present in our day-to-day lives. But there is so much to see and do. This issue of PCB007 Magazine previews many of the important events taking place at the show this year and highlights some changes and opportunities. Let us help you map out your show plan. This issue is focused on the PCB fabricator’s show experience and how you can get the most from your valuable time and investment in attending the show. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Averatek to Present 'Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs' at IPC APEX EXPO
10/29/2021 | AveratekAveratek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, “Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs” during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California.
IPC APEX EXPO 2022 Attendees Can Achieve Digital Transcendence at Show Networking Events
10/13/2021 | IPCIPC APEX EXPO 2022 attendees can meet with electronics industry innovators and connect with peers all in one place at the San Diego Convention Center, January 22–27, 2022.
Foundations of the Future: IPC Education Foundation Lessons Learned
06/29/2021 | IPC Education Foundation -- Column: Foundations of the FutureLooking back on our second year, the IPC Education Foundation (IPCEF) takes pride in how we how we adjusted our engagement initiatives during the pandemic. We couldn’t rely on our original strategy of hosting and attending a range of in-person activities and events.
Dave Bergman on IPC and CFX
07/03/2018 | Barry Matties, I-Connect007The recent SMT Hybrid Packaging show in Nuremberg, Germany, marked the second opportunity for IPC to showcase its new Connected Factory Exchange (CFX) initiative. In this interview, David Bergman, VP for international relations at IPC, tells us more on the overall reception of CFX and the benefits users are seeing thus far. He also provides an update on what’s next for the open source standard.