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Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
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IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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Why You Should Attend IPC APEX EXPO 2018
February 6, 2018 | IPCEstimated reading time: 1 minute
The IPC APEX EXPO 2018 is just weeks away. To be held from February 24 to March 1 at the San Diego Convention Center in California, USA, the event has continuously hosted many visitors from the electronics manufacturing industry all around the world.
Here are the top three reasons attendees have indicated why they attend IPC APEX EXPO, and why you should, too.
1. Education you can only get by attending IPC APEX EXPO.
The world's premier Technical Conference: Education that teaches the practical. Stringently vetted content that's never been presented elsewhere; we deliver the latest research and innovations from subject matter experts in the areas of board fabrication and design, and electronics assembly.
Professional Development Courses to boost your career: Get up to speed on the latest in design, materials, process improvement, solder joint reliability and more with over 30 courses delivered by corporate technologists, consultants, training center staff and university faculty.
Design Forum: Some of the industry's most distinguished experts deliver design-focused education on the hottest topics such as Printed Circuit Board 4.0 and Key Design Considerations that impact cost & affect manufacturability of PCBs.
Buzz Sessions: Get key insights on the hot industry trends such as 3D Printed Electronics, Industry 4.0 and E-Textiles - topics that point the way toward tomorrow.
2. Build a network that takes you in new directions.
Connect with thousands of your electronics industry peers from around the globe in sessions, on the exhibit show floor, at dinner, lunch or breakfast. Find valuable networks that improve your company's performance, further your personal success, make new connections and strengthen existing relationships.
3. Experience the largest collection of industry suppliers all under one roof.
Explore and compare equipment from more than 470 of the industry's top suppliers. Discover new processes to gain greater efficiency. Find new suppliers to save you both time and money and uncover new solutions that will help you deliver at the velocity of technology.
To register, click here.
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05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
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Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
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BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.