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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Foxconn Czech Tech Day Showcases Cutting-Edge AI, Robotics, and Electric Mobility

07/06/2026 | Foxconn
Hon Hai Technology Group (Foxconn) hosted the Czech Tech Day technology exhibition at its Pardubice facility, showcasing the latest high-tech products shaping the present and future of industry.

Call for Participation Now Open for the Global Electronics Association’s Advanced Electronic Packaging Conference at APEX EXPO 2027

07/06/2026 | Global Electronics Association
The Call for Participation is now open for the Advanced Electronic Packaging Conference (AEPC) 2027 – Component-to-System-Level Integration – taking place during APEX EXPO 2027 in Anaheim, California.

Teledyne's Emerald 67M Space Camera Enabled by SDL License

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Micron, General Motors Sign Strategic Agreement to Secure Supply and Accelerate Innovation

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Micron Technology, Inc. and General Motors announced a Strategic Customer Agreement (SCA) to secure a long-term, reliable supply of memory and storage platforms critical to GM’s vehicle production and delivery at scale.

50 Years in Fehring: AT&S Invests Millions in Future of Site in Austria

07/03/2026 | AT&S
AT&S is celebrating the 50th anniversary of PCB volume production at its Austrian site in Fehring and sending a strong signal for the future: With another multi-million euro investment, the company is strengthening its expertise in the PCB business and opening up new growth opportunities in strategically important future markets.
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