AT&S Fehring Plant: EUR 10 Million Investment and 70 New Jobs
February 12, 2018 | AT&SEstimated reading time: 1 minute

With the expansion project, which involves investments of EUR 10 million, the AT&S plant in Fehring will receive a significant technological upgrade: Starting in March 2019, high-end printed circuit boards will be manufactured in Fehring, primarily for the Automotive sector – high-frequency printed circuit boards for applications in the area of autonomous driving, for example sensors for distance measurements. In addition, products for civil aviation will be produced in cooperation with the Leoben site, as well as printed circuit boards for medical applications.
“With this technology expansion and an additional 1,200 square meters of space, around 70 new jobs will be created,” said AT&S CEO Andreas Gerstenmayer. “And the site will be secured within the AT&S Group in the long term. This is a strong signal for the industrial development in the region of South East Styria and is fully in line with our strategy to develop sites further through technology expansion. We also receive valuable support from the province of Styria in this project.”
Barbara Eibinger-Miedl, member of the provincial government responsible for economic affairs, added, “AT&S is an important lead company in Styria and makes a significant contribution to the positive development of the local economy with its research projects and products. The expansion of the Fehring site is an investment in the future, which provides for value creation, new jobs and consequently quality of life in the region. I would like to thank Andreas Gerstenmayer and the entire AT&S team for this strong commitment to Styria as a business location!”
Heinz Moitzi, chief operations officer, emphasizes the importance of the topic of qualification.
“The state-of-the-art technology used is an excellent opportunity for the employees to further improve their qualifications. This refers especially to the topic of automation and therefore represents a very good opportunity for the applications in the latest standards for Industry 4.0.”
Suggested Items
Hon Hai Research Institute Partners with Taiwan Academic Research Institute and KAUST to Participate in CLEO 2025
05/30/2025 | FoxconnThe research team of the Semiconductor Division of Hon Hai Research Institute, together with the research teams of National Taiwan University and King Abdullah University of Science and Technology in Saudi Arabia, has successfully made breakthroughs in multi-wavelength μ -LED technology to achieve high-speed visible light communication and optical interconnection between chips.
Meyer Burger Shuts Down Solar Module Production, Lays Off 282 Employees in the U.S.
05/30/2025 | Meyer BurgerMeyer Burger Technology AG is forced to stop its solar module production in the U.S., which is still ramping up, due to a lack of funds. On May 29, 2025, all 282 remaining employees at the Goodyear, Arizona, site received their notices of termination. Production with an annual capacity of 1.4 gigawatts was shut down immediately.
VJ Electronix Appoints Marco Cruz as Mexico Regional Sales Manager
05/30/2025 | VJ ElectronixVJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce the appointment of Marco Antonio Cruz Tovar as Mexico Regional Sales Manager.
Arrow Electronics Earns Dual Honors as Dell Technologies Partner of the Year
05/29/2025 | BUSINESS WIREGlobal technology solutions provider Arrow Electronics has received two prestigious awards from Dell Technologies: 2025 OEM Solutions Partner of the Year and 2025 North America Distributor of the Year. The awards were announced at Dell Technologies World, held in Las Vegas in late May.
Imec Unveils Record-Low Loss 300mm RF Silicon Interposer for Sub-THz Systems
05/27/2025 | ImecAt the IEEE ECTC 2025 conference, imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – highlights the exceptional performance and flexibility of its 300mm RF silicon interposer platform.