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I-Connect007 Invites College Students to Participate in Photographic Coverage of IPC APEX EXPO 2018
February 12, 2018 | I-Connect007Estimated reading time: 1 minute
 
                                                                    I-Connect007 has invited local college students to participate in the company’s photographic coverage of IPC APEX EXPO 2018 in San Diego, California.
Students will be given a brief overview of trade show photography tips before being sent onto the show floor in I-Connect007 shirts. At the end of the event, the students’ photos will be reviewed and selected for publication in I-Connect007’s magazines, newsletters, and websites. Each participant will be awarded prize money based on their top submitted photos.
This partnership between I-Connect007 and local colleges will provide the students with a great opportunity to hone their photographic skills and connect the experience to their classroom studies. Trade shows can be a challenging environment to capture unique, quality photos due to numerous factors, such as lighting variations between booths and a large show floor to cover.
“Inviting students to photograph the IPC APEX EXPO 2018 will allow them to gain experience and add content to their personal portfolios. Plus, it allows I-Connect007 to involve young, local talent in our trade show coverage and showcase their work,” says Barry Matties, I-Connect007 publisher.
IPC APEX EXPO is North America’s largest electronics interconnect industry trade show that attracts industry leaders from around the world to network and demonstrate new equipment and technology. This trade show focuses on the printed circuit board and electronics manufacturing industry.
IPC APEX EXPO 2018 will be held at the San Diego Convention Center from February 24 to March 1. If you plan on attending the show, visit I-Connect007 at Booth #2645 and look for our student photographers on the show floor.
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
                                         Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
                                         Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control





 
                     
                 
                    