Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Nordson YESTECH to Showcase New Dual-Sided PTH AOI Solution at IPC APEX 2018
February 12, 2018 | Nordson YESTECHEstimated reading time: 2 minutes
Nordson YESTECH, a subsidiary of Nordson Corporation and a leading supplier of automated optical and conformal coating inspection systems for the electronics industry, will feature the new high speed FX-942 dual sided PTH automated optical inspection system for populated printed circuit boards, at the annual APEX 2018 show held at the San Diego Convention Center, in San Diego, California from February 26th to March 1st. They will conduct live demonstrations in the booth of their complete line of AOI and Conformal Coating inspection systems.
Nordson YESTECH’s FX-942 dual sided AOI system is ideally suited to inspect the unique challenges of plated through hole (PTH) assemblies, offering high-speed inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly in pre-wave or post-wave applications. The FX-942 ideally complements Nordson SELECT’s Selective Soldering systems providing inspection capabilities for demanding soldering applications.
Programming the FX-942 is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The FX-942 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.
The FX-942 saves valuable inspection time, delivering a complete, high-speed automated inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts featuring:
- Dual sided imaging with full travel imaging sensors
- 1 vertical and 4 optional angle cameras per side
- Up to 100 mm clearance
- High speed inspection and transfer
- High defect coverage / low false failure
- Picture in Picture (P-in-P) feature
- MES / Industry 4.0 compatible
The FX-942 is highly effective for selective solder, post-wave and connector inspections, enabling users to improve quality and enhance yields. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
“We are very pleased to once again be exhibiting our latest inspection solutions at APEX 2018,” said Don Miller, Nordson YESTECH Vice President. “APEX is the ideal opportunity to meet with our valued customers and demonstrate YESTECH’s latest advancements in AOI. The FX-942 is yet another example of new inspection technology from Nordson YESTECH and we look forward to discussing the many benefits
About IPC Printed Circuits Expo, APEX 2018
The electronics industry’s own event – a celebration of printed circuit board and electronics manufacturing and test technology. Find the technology you need, meet new suppliers, network with industry experts, learn from new research papers and return to your company with the solutions you need. For more information about IPC Printed Circuits Expo. APEX 2018 and to register, click here.
About Nordson YESTECH
Headquartered in Carlsbad, California, Nordson YESTECH is a leading provider of automated optical systems with integrated yield enhancement solutions for the printed circuit board assembly and advanced semiconductor-packaging industries, Nordson YESTECH is operated and managed by a team of industry experts with a history of success, bringing powerful and cost-effective inspection to the electronics market. The company has sales offices and customer support centers in North America, Asia and Europe. For more information on Nordson YESTECH and its products, click here.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, to test and inspect for quality, and to treat and cure surfaces. These products are supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.