-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Nordson YESTECH to Showcase New Dual-Sided PTH AOI Solution at IPC APEX 2018
February 12, 2018 | Nordson YESTECHEstimated reading time: 2 minutes
Nordson YESTECH, a subsidiary of Nordson Corporation and a leading supplier of automated optical and conformal coating inspection systems for the electronics industry, will feature the new high speed FX-942 dual sided PTH automated optical inspection system for populated printed circuit boards, at the annual APEX 2018 show held at the San Diego Convention Center, in San Diego, California from February 26th to March 1st. They will conduct live demonstrations in the booth of their complete line of AOI and Conformal Coating inspection systems.
Nordson YESTECH’s FX-942 dual sided AOI system is ideally suited to inspect the unique challenges of plated through hole (PTH) assemblies, offering high-speed inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly in pre-wave or post-wave applications. The FX-942 ideally complements Nordson SELECT’s Selective Soldering systems providing inspection capabilities for demanding soldering applications.
Programming the FX-942 is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The FX-942 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.
The FX-942 saves valuable inspection time, delivering a complete, high-speed automated inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts featuring:
- Dual sided imaging with full travel imaging sensors
- 1 vertical and 4 optional angle cameras per side
- Up to 100 mm clearance
- High speed inspection and transfer
- High defect coverage / low false failure
- Picture in Picture (P-in-P) feature
- MES / Industry 4.0 compatible
The FX-942 is highly effective for selective solder, post-wave and connector inspections, enabling users to improve quality and enhance yields. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
“We are very pleased to once again be exhibiting our latest inspection solutions at APEX 2018,” said Don Miller, Nordson YESTECH Vice President. “APEX is the ideal opportunity to meet with our valued customers and demonstrate YESTECH’s latest advancements in AOI. The FX-942 is yet another example of new inspection technology from Nordson YESTECH and we look forward to discussing the many benefits
About IPC Printed Circuits Expo, APEX 2018
The electronics industry’s own event – a celebration of printed circuit board and electronics manufacturing and test technology. Find the technology you need, meet new suppliers, network with industry experts, learn from new research papers and return to your company with the solutions you need. For more information about IPC Printed Circuits Expo. APEX 2018 and to register, click here.
About Nordson YESTECH
Headquartered in Carlsbad, California, Nordson YESTECH is a leading provider of automated optical systems with integrated yield enhancement solutions for the printed circuit board assembly and advanced semiconductor-packaging industries, Nordson YESTECH is operated and managed by a team of industry experts with a history of success, bringing powerful and cost-effective inspection to the electronics market. The company has sales offices and customer support centers in North America, Asia and Europe. For more information on Nordson YESTECH and its products, click here.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, to test and inspect for quality, and to treat and cure surfaces. These products are supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.