-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young Adds Value to Pre-Reflow with Panasonic APC System
February 13, 2018 | Koh Young TechnologyEstimated reading time: 2 minutes
Koh Young Technology announces its Zenith 3D AOI System is fully connected to Panasonic NPM and APC (Advanced Process Control) Systems. The Zenith 3D AOI System is the first certified APC-ready 3D AOI for 0201M components, which can improve yields in high density placements. The Koh Young Zenith 3D AOI can feed correct mounting position values to Panasonic NPM mounters ensuring components are mounted in the targeted position as intended. This feature, also known as APC-MFB (Advanced Process Control-Mounter Feedback), improves process repeatability by automatically adjusting component placement to the paste, rather than to the pad location. Moreover, APC-MFB will catch the shift trend and conduct further position correction by using true 3D measurement data from the Zenith AOI system.
To achieve this M2M feedback, Koh Young has undergone rigorous verification with 10um and 15um Zenith 3D AOI systems. Upon successful completion of testing, Koh Young has been certified for 0201M components in addition to 0402M components; making them a leading solution provider for microchip mounting reliability.
Commenting on their successful partnership with Panasonic Smart Factory Solutions Co. Ltd, Nobuo Kobayashi, Managing Director of Japan Koh Young Co. Ltd, commented, "We are honored to join the trusted APC Alliance as our vision is to deliver Agile Manufacturing innovation to our customers. We believe our superior feedback capability of the APC ready Zenith will deliver quality pre-reflow yield and develop minimum industry standards for narrow pitch placement of microcomponents."
In addition to this innovation, Koh Young will highlight a broad range of additional technologies, while taking part in several show activities, including topical roundtable discussions and interviews on the smart factory and inspection process. Visit Koh Young at booth 2733.
About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, and the United States. The local facilities ensure Koh Young provides close communication and support to its customers, while providing a global network of process experts.
For more information, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
Foxconn, ElectroMobility Poland in Strategic Partnership to Develop Electric Vehicle Ecosystem
05/08/2026 | FoxconnHon Hai Technology Group (Foxconn) plans to accelerate the development of clean mobility in the European region in strategic partnership with state-backed ElectroMobility Poland S.A. (EMP), the key driver of an ambitious initiative to raise the technological and operational capabilities of the electric vehicle ecosystem in Poland and the broader region.
Flex Plans Cloud and Power Unit Spin-Off
05/08/2026 | FlexFlex announced that its Board of Directors has unanimously approved moving forward with a plan to spin off its Power and Cloud portfolio from Flex, creating two independent, publicly traded companies, each optimally positioned to serve their customers and create value for their shareholders.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.