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Zestron's Umut Tosun to Lead Pro Development Course at IPC APEX EXPO 2018
February 15, 2018 | ZESTRONEstimated reading time: 1 minute
ZESTRON has announced that Umut Tosun M.S.Ch.E., will instruct a professional development course at IPC APEX EXPO 2018. "Electronic Assembly Reliability—Meeting the Challenges of Today's Design" is scheduled during the PD25 session on Thursday, March 1 from 9:00 AM to 12:00 PM.
Electronics design and assembly continues to evolve in complexity and performance and at an ever increasing rate. Likewise, solder paste formulations have evolved yielding products that are halide-free, lead-free, and with low solids as in the case of No Clean pastes and fluxes. In order to meet the ever increasing reliability challenges posed by electronics manufacturing, significant developments have been made regarding cleaning technology. This course has been developed to address the electronics cleaning challenges and the latest cleaning technology trends.
Tosun is the application technology manager at ZESTRON Americas. As an active member of the SMTA and IPC, he has presented numerous technical studies at key industry events addressing critical cleaning challenges within electronics manufacturing. He has been an instructor at IPC sponsored Professional Development seminars, SMTA sponsored webtorials as well as numerous regional technical workshops. Additionally, he has been the recipient of awards recognizing his contributions to the industry.
For more information on this course or to register, please visit IPC APEX EXPO.
About ZESTRON
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics and semiconductor manufacturing industries. With seven worldwide technical centers and the largest team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information and to tour one of our unparalleled technical centers, please click here.
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Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
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Advancing Photonic Soldering
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Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
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