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John Hengst Joins Inovaxe as Regional Sales and Channel Partner Manager
February 15, 2018 | Inovaxe Corp.Estimated reading time: 1 minute
Inovaxe is pleased to announce that it has hired John Hengst as its new Regional Sales and Channel Partner Manager, located in Chicago, Illinois.
Hengst joins Inovaxe with many years of experience with Panasonic, Assembleon and Fuji. He will work with the company’s current sales team and representatives, and expand Inovaxe’s sales channel partners.
Margy Khoshnood, Inovaxe’s VP of Sales, commented, “John is a respected expert in our industry and brings a new perspective to help us continue to provide the best service to our customers. We are excited to welcome him to our Inovaxe team.”
Hengst can be reached at 954-871-5216 or by email at John.hengst@inovaxe.com.
About Inovaxe Corp.
Inovaxe Corporation is focused on delivering innovative production and inventory management solutions to the electronics industry. The Company’s product offering includes Smart and Passive storage carts and racks (InoAuto, InoBin, InoTube, InoTray, InoReel, InoCarts and InoKits) and Moisture Sensitive Device Material Storage Hardware (InoCart MSD), an inventory/kitting software management tool (InoView), and InoAuto Locator software for locating components. For more information and a demonstration of Inovaxe product offerings, click here.
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"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.