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Nordson YESTECH Installs Benchtop AOI at Fluid Components International
February 19, 2018 | Nordson YESTECHEstimated reading time: 2 minutes
Nordson YESTECH is pleased to announce that Fluid Components International (FCI) has purchased and installed a BX Benchtop AOI system. FCI designs and manufactures thermal mass flow meters, flow switches and level switches used worldwide in industrial process measurement and control applications.
FCI products deliver rugged, robust, superior quality flow and level measurement solutions to chemical manufacturing, oil & gas processing, refineries, power plants, wastewater treatment plants, mining, aerospace and many more.
Ralph Weller, FCI's Director of Manufacturing, “FCI is committed to continuous improvement and automation to deliver the highest quality products to our customers. The YESTECH AOI system provided immediate feedback on the quality of both our pick-and-place, and soldering processes, resulting in faster corrective actions and direct cost savings. What used to be a three minute or longer manual inspection using magnification, now takes only 2-4 seconds using the YESTECH AOI machine. A very valuable feature is that the machine can be ‘taught’ to ignore false positives to eliminate repeating unnecessary failure analysis. The combination of direct cost savings and cost avoidances achieved a payback in just a few short months.”
Nordson YESTECH's advanced 5 megapixel color camera imaging technology offers benchtop PCB inspection with exceptional defect coverage. This benchtop system inspects solder joints and verifies correct part assembly, enabling FCI to improve quality and increase throughput. The system’s four side-viewing cameras add additional inspection capabilities found only on in-line systems.
The BX is equally effective for paste, pre / post-reflow and even final assembly inspection. Remote programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
Fluid Components International is a global company committed to meeting the needs of its customers through innovative solutions to the most challenging requirements for sensing, measuring and controlling flow, level and temperature of air, gases and liquids. For more information, click here.
About Nordson YESTECH
Headquartered in Carlsbad, California, Nordson YESTECH is a leading provider of automated optical inspection systems with integrated yield enhancement solutions for the printed circuit board assembly and advanced semiconductor-packaging industries, Nordson YESTECH is operated and managed by a team of industry experts with a history of success, bringing powerful and cost-effective inspection to the electronics market. The company has sales offices and customer support centers in North America, Asia and Europe. For more information on Nordson YESTECH and its products, click here.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems that dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, test and inspect for quality, and treat and cure surfaces, and are supported by application expertise and direct global sales and service. Nordson serves many consumer non-durable, durable and technology end-markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954, headquartered in Westlake, Ohio, Nordson has operations and support offices in nearly 40 countries. Visit Nordson here.
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.