Learning with Leo: Drones—Meeting Demand Without Compromise
Nolan’s Notes: Our Spotlight on North America
Global Sourcing Spotlight: Building a Supply Chain That Bends, Not Breaks
Yamaha to Release Latest Modular Mounter
February 19, 2018 | Yamaha Motor EuropeEstimated reading time: 2 minutes
Yamaha Motor Europe announces the April 1, 2018 release of the new Σ-G5S II, a surface mounter model that further improves upon the Σ-G5S premium modular mounter that achieved both high speed and versatility, and caters to various components with its rotary head design based on our “1-head solution” concept.
The Σ-G5S II retains all the features of its predecessor, including the high-speed high-accuracy rotary direct-drive head, the overdrive motion for highly efficient production by picking up components from either the front or rear feeder on the machine, and the Super Loading (SL) feeder that facilitates splicing-less component supply. It also gains new head designs, an improved PCB feeding sequence, an enlarged internal buffer size for feeding larger PCBs and more to improve productivity. Additionally, its mounting speed of 90,000 CPH (under optimum conditions) represents an improvement of approximately 20% compared to the Σ-G5S.
Quality has also been improved by extending the detection range of components held by the mounter to immediately before placement. In addition, reliability has been further enhanced due to better balance for the beam motors to bolster stability, lower internal temperature by improving cooling performance, extending the service life of important components like the high-speed multi-purpose head and more.
About Yamaha SMT Section
Yamaha Surface Mount Technology (SMT) Section is a subdivision of Yamaha Motor Robotics Business Unit in Yamaha Motor Corporation. Yamaha surface mount equipment is highly acclaimed in the market for their “module concept” that enables them to keep pace with the trend toward smaller and more diverse electric/electronic parts being mounted on circuit boards.
Yamaha SMT Section has created a strong business in the surface mount industry that enables design and engineering, manufacture, sales and service to be conducted in one comprehensive system. Furthermore, the Company has used its core technologies in the areas of servo-motor control and image recognition technology for vision (camera) systems to develop solder paste printers, 3D solder paste inspection, 3D PCB inspection machines, flip chip hybrid placers and dispensers. This allows Yamaha SMT Section to offer a full line of machines for electric/electronic parts mounting and propose optimum production-line makeup to answer the diversifying needs of today’s manufacturers.
Yamaha SMT Section has sales and service offices in Japan, China, Southeast Asia, Europe and North America provide a truly global sales and service network that will safeguard best in class on-site sales & service support for clients. For more information, click here.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.