The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Yamaha to Release Latest Modular Mounter
February 19, 2018 | Yamaha Motor EuropeEstimated reading time: 2 minutes
Yamaha Motor Europe announces the April 1, 2018 release of the new Σ-G5S II, a surface mounter model that further improves upon the Σ-G5S premium modular mounter that achieved both high speed and versatility, and caters to various components with its rotary head design based on our “1-head solution” concept.
The Σ-G5S II retains all the features of its predecessor, including the high-speed high-accuracy rotary direct-drive head, the overdrive motion for highly efficient production by picking up components from either the front or rear feeder on the machine, and the Super Loading (SL) feeder that facilitates splicing-less component supply. It also gains new head designs, an improved PCB feeding sequence, an enlarged internal buffer size for feeding larger PCBs and more to improve productivity. Additionally, its mounting speed of 90,000 CPH (under optimum conditions) represents an improvement of approximately 20% compared to the Σ-G5S.
Quality has also been improved by extending the detection range of components held by the mounter to immediately before placement. In addition, reliability has been further enhanced due to better balance for the beam motors to bolster stability, lower internal temperature by improving cooling performance, extending the service life of important components like the high-speed multi-purpose head and more.
About Yamaha SMT Section
Yamaha Surface Mount Technology (SMT) Section is a subdivision of Yamaha Motor Robotics Business Unit in Yamaha Motor Corporation. Yamaha surface mount equipment is highly acclaimed in the market for their “module concept” that enables them to keep pace with the trend toward smaller and more diverse electric/electronic parts being mounted on circuit boards.
Yamaha SMT Section has created a strong business in the surface mount industry that enables design and engineering, manufacture, sales and service to be conducted in one comprehensive system. Furthermore, the Company has used its core technologies in the areas of servo-motor control and image recognition technology for vision (camera) systems to develop solder paste printers, 3D solder paste inspection, 3D PCB inspection machines, flip chip hybrid placers and dispensers. This allows Yamaha SMT Section to offer a full line of machines for electric/electronic parts mounting and propose optimum production-line makeup to answer the diversifying needs of today’s manufacturers.
Yamaha SMT Section has sales and service offices in Japan, China, Southeast Asia, Europe and North America provide a truly global sales and service network that will safeguard best in class on-site sales & service support for clients. For more information, click here.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.