-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Heraeus Launches Low-Temp Lead-Free Solder Paste
February 23, 2018 | Heraeus ElectronicsEstimated reading time: 1 minute
Heraeus Electronics has announced a new addition to its popular family of low-temperature solder pastes. The recently-developed Heraeus F 498 solder paste is designed for extremely low mid-chip balling and features the BiSn57Ag1 alloy for higher reliability in a variety of applications, including automotive, LED Level 2 and consumer electronics.
The newest addition to the Heraeus series of lead-free solder pastes is designed to address the challenges manufacturers face.
"Lead-free applications typically require higher processing temperatures, but many of the components in the assembly process can tolerate those higher temperatures. Our F 498 solder paste is the answer to that issue," said Mark Challingsworth, Global Head of Marketing for Heraeus Electronics.
Developed to help manufacturers address the competitive cost challenges of the market while delivering superior performance, Heraeus F 498 lead-free, low-temperature solder paste is specifically designed for step-soldering when a second, lower temperature reflow process is needed. It is ideal for temperature-sensitive components as well as low-melting, flexible circuitry used in smart devices. It offers excellent wetting performance on iSn and NiAu, provides extremely low beading and is RoHS compliant. Additionally, the paste supports the switch from wave-soldering to SMT with higher product quality, and operating temperatures up to 110°C are achievable.
The F 498 paste also delivers reduced energy consumption in the reflow process due to lower reflow temperature and less requirements for production floor and PCB cooling. In a high-volume factory, low-temperature solding can utilize a single-pass process, producing significant savings in direct operational costs in electrical usage and CO2 emission reduction.
Challingsworth added, "The F 498 solder paste is a win-win solution for manufacturers using a single-pass process. It can lower per-component costs without sacrificing reliability and joint strength. Further, manufacturers can increase the lifetime of their equipment as well as reduction in associated maintenance costs, since longer maintenance periods will be possible due to reduced contamination of equipment."
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.