-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Rehm Showcases Innovative Systems at Leading Trade Fairs Worldwide
February 26, 2018 | Rehm Thermal SystemsEstimated reading time: 3 minutes
This year, Rehm Thermal Systems is being represented at the well-known international trade fairs and is showcasing the newest plant and systems engineering in the areas of reflow soldering with convection and condensation, as well as circuit board coating for producing electronics. Visit us in March at productronica China in Shanghai and AMPER in Brno or in April at ElectronTech in Moscow and NEPCON China in Shanghai.
March 14-16, 2018: productronica China, Shanghai
Started in Munich and developed further for the growing markets in China and India, the Munich trade fair, along with its subsidiaries abroad, has set up a global electronics network for the entire industry with the highest level of quality and professionalism. The global electronics community meets every year at the productronica trade fair to discover the newest innovations and trends, custom-made products for local markets and specific impulses and ideas for future industry development.
For the first time, Rehm is now also being represented at productronica China in Shanghai at the New International Expo Centre, with its own stand. Our trade fair team are looking forward to your visit to trade fair stand E2-2107.
March 20-23, 2018: AMPER, Brno, Czech Republic
AMPER, held in Brno in the Czech Republic, is one of the largest trade events for the electronics industry in Europe. Rehm Thermal Systems will also be there this year as an exhibitor and is presenting innovative solutions from the 20th - 23rd March 2018. As an established manufacturer of reflow soldering units with convection, condensation and vacuum, Rehm has already made a name for itself in the eastern European electronics market. Our team is showcasing our tried and tested reflow soldering system VisionXC on site in Hall F, stand 2.17. What’s impressive is its compactness, which brings together all important technological features in the smallest possible space. The VisionXC is the ideal convection soldering system for small and medium production batches, in the lab or for demo lines!
April 17-19, 2018: ElectrontechEXPO, Moscow
Once again, at the ElectrontechEXPO in Moscow, our customers have the chance to find out about the newest developments in the thermal system solutions sector by Rehm. The Rehm team, for the branch founded in 2015, are on site and are at the trade fair stand B 227 in pavilion 3 to advise the visitors extensively on innovations. For the first time, we will present the new contact soldering system Nexus to the Russian market. The vacuum soldering furnace from Rehm Thermal Systems is perfectly suited for production facilities operating in the flux and shrinkage-free soldering sector with various process gases. Unleaded and leaded pastes can also be used, as well as soldering forms with and without soldering flux. Miniaturisation in the Advanced Packaging and Semiconductor sector can be boosted further using the vacuum technology. Also being exhibited is VisionXC, the impressive reflow soldering system, which combines all important technological features in the smallest possible space.
April 24-26, 2018: NEPCON China, Shanghai
Rehm is also showcasing innovative plant engineering for producing electronics in the Asian region at NEPCON Shanghai.
NEPCON China is one of the biggest and most prominent electronics industry trade fairs in Asia. Leading companies come to Shanghai from all over the world to present innovations and the newest plant engineering in the electronics production sector. This year, Rehm Thermal Systems is presenting technological highlights of reflow convection soldering to visitors at stand 1F20.
About Rehm Thermal Systems
Having specialised in the field of thermal system solutions for the electronics and photovoltaics industry, Rehm is a technological and innovative leader in the state-of-the-art, cost-effective manufacturing of electronic assemblies. As a globally active manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for metallisation of solar cells as well as numerous customised systems, we are present in all key growth markets as a partner with more than 25 years of industry experience, allowing us to implement innovative production solutions that set new standards. For more information, click here.
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.