-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Tate Technology Adds to their Placement Platform with Another Purchase of ASM E-By-SIPLACE (EBS) from Technica USA
February 27, 2018 | Technica USAEstimated reading time: 2 minutes
Frank Medina, president of Technica USA, stated, “Technica USA and our supply partner, ASM Assembly Systems are very pleased to receive an order for the third EBS placement machine from Tate Technology. They spent a tremendous amount of time two years ago evaluating the placement technology available on the market that would satisfy their current and future demands. We were very pleased to be selected as their product of choice”.
Scott Tate, President of Tate Technology stated, “The ASM EBS system is a complete game changer for us. After a comprehensive and lengthy review of eight competing systems we chose ASM. Now after 18 months of running the EBS we can say with certainty that they deliver in every aspect. We saw 20% growth in 2017 and attribute much of that growth from our ability to say “yes” to our customer’s requests more often both in terms of order quantity and complexity. In previous years we may have no-bid some of these projects based on the order size exceeding our SMT throughput, if the component count was too high, or if the component size was too small. Our core business is quick-turn, regardless of volume. The EBS is not only fast but flexible, placing 01005’s to large connectors all in the same machine. Two preferred features are the ability to load two-inch strips of cut-tape without splicing and teaching new components on the machine without having to define them ahead of time. Features such as this are invaluable for our ability to support customers with the shortest lead times”
Medina concluded, “Surely we have had much success with the E-By-SIPLACE and the E-By-DEK products since their introduction to the U.S. two years ago. ASM has designed these machines using much of the technology that has proven to be successful with their high volume, high speed equipment. As their Master Distributor in the U.S. we are very pleased to be able to offer the low-mid volume customers with a very economical and highly capable choice for screen printing and placement.”
About Tate Technology
Tate Technology, Inc is an award winning electronics manufacturer located in Spokane, WA. They serve not only their regional Northwest market but have customers across the country and globe including England, Panama, Mexico, and New Zealand. Their ability to be nimble and flexible help bring their customer’s products to market in record time; both during product development and production. Started in 1992, Tate Technology is engineering owned and operated allowing the focus to be on problem solving and achieving 100% customer satisfaction on all fronts. With all new placement machines, solder paste printers, and AOI machines, Tate Technology is well positioned to achieve the highest levels of throughput, quality, and competitiveness for many years to come. For more information, click here.
About Technica USA
Technica, USA provides the highest quality equipment and process materials, manufactured worldwide, for the printed circuit board fabrication and assembly markets as well as the microelectronic, photovoltaic and printed electronics markets.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.