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Pickering Electronics Joins the Electronics Representatives Association
February 27, 2018 | Pickering ElectronicsEstimated reading time: 1 minute
Pickering Electronics, a UK designer and manufacturer of Reed Relays, has announced they are now a member of the Electronics Representatives Association (ERA), the international trade organization for professional field sales companies in the global electronics industries, manufacturers who go to market through representative firms and global distributors.
Since 1968, Pickering Electronics have been manufacturing high quality Reed Relays for Instrumentation and Automatic Test Equipment (ATE), High voltage switching, Low thermal EMF,direct drive from CMOS, RF switching and other specialist applications.
Pickering Electronics has developed a solid customer base in a wide range of industries/applications, including their sister company; Pickering Interfaces; designers and manufacturers of modular PCI/PCI/LXI Switching Systems. Pickering Interfaces are a large Reed Relay customer who work very closely with Pickering Electronics on leading edge Reed Relay designs, reliability testing, life testing, production engineering, amongst other things. This close relationship greatly benefits both companies and gives Pickering Electronics a strong insight into demanding functional test Reed Relay applications.
Consecutive years of double-digital growth in sales, and recent investments to expand the capacity of the organisation, have led Pickering Electronics to update their strategy in the USA, to begin establishing strategic partnerships with representatives and distributors that are focused on the electronic components/test and measurement market. For more information, click here.
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Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
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