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Seika Machinery Presents Top Sales Awards at IPC APEX EXPO
February 27, 2018 | Seika Machinery, Inc.Estimated reading time: 1 minute
Seika Machinery, Inc. today announced that it recognized its top representatives for 2017 with sales awards during the IPC APEX EXPO in San Diego, California. Seika Machinery is proud to announce the top sales teams for McDry, Sawa, Malcom and Unitech as follows:
- #1 McDry Sales for 2017: Assembly Tech, Mr. Armand Karolian, New England Territory
- #2 McDry Sales for 2017: Hisco Dallas, Mr. Mike Olsen, Dallas, Texas
- Top Distributor for McDry Sales in 2017: Hisco, Mr. William Bland, North America
- Top Distributor for Sawa Sales in 2017: Solcom, Mr. Mike Gusukuma, Mexico
- Top Distributors for Malcom Sales in 2017: GPS, Mr. Andreas Gerspach, Germany/EU and Ceiba Technologies, Mr. Ernesto Bader, Mexico
- Top Sales Representative for New Unitech Sales in 2017: Mr. Humberto Bojorquez, Mexico
“Congratulations to these sales representatives and to all of our fine network members for your activity on McDry, Sawa, Malcom, Unitech and Sayaka equipment on behalf of Seika Machinery,” commented Michelle Ogihara, Seika Machinery’s Senior Sales and Marketing Manager.
Each of the winning companies were presented with plaques at Seika’s annual training meeting and awards ceremony, which was held on Tuesday, February 27 in Seika Machinery’s booth on the show floor.
About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services. For more information about Seika Machinery, click here.
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TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
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