Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Metcal Wins 2018 NPI Award for Robotic Soldering
February 28, 2018 | MetcalEstimated reading time: 1 minute
Metcal announces that it has been awarded a 2018 NPI Award in the category of Repair and Rework for its Connection Validation (CV) Robotic Soldering System. The award was presented to the company during a Tuesday, February 27, 2018 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. The Connection Validation Robotic Soldering System is the newest example of Metcal’s industrial ingenuity.
Robotic soldering is becoming more commonplace as manufacturers look to reduce risk and increase productivity. Metcal’s new CV Robotic Soldering System addresses these needs by combining its patented CV technology with a new Smart Interface System. CV reduces unnecessary dwell time by signalling to the system to move to the next solder joint in the program after a good joint is formed. The Smart Interface System simplifies the programming process by integrating system controls through an easy to use interface.
“After winning the NPI Award for hand soldering with Metcal’s Connection Validation Soldering System last year, we are very excited to win again this year with our CV Robotic Soldering System,” said Christopher Larocca, President of OK International, which owns Metcal. “Robotic soldering is the next technological step in mitigating the risk of product failures through the integration of the Connection Validation technology with our new Smart Interface System.”
Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
About Metcal
Metcal is a benchtop solutions expert that has delivered broad value to customers since its Silicon Valley beginnings in 1982. Offering unrivalled performance, risk mitigation, and ROI, we give electronics manufacturers in automotive, aerospace, medical devices and military sectors the tools—and the confidence—they need to develop faster, safer, more advanced products. Metcal provides advanced technology products across hand soldering, convection rework, fume extraction, and fluid dispensing applications. For more information, click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.