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Indium, SMT Thermal Tech to Demonstrate Low-Temp Reflow Energy Savings

10/05/2026 | Indium Corporation
Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will explore how combining innovative solder materials with optimized reflow oven technology can reduce energy consumption at the Expo for Electronics Manufacturing (EFX), October 6-8, in Stuttgart, Germany.

October SMT007 Magazine Examines Automotive Soldering Reliability

10/01/2026 | I-Connect007 Editorial Team
The October 2026 issue of SMT007 Magazine is now available. As automakers add more electronics while maintaining high production volumes, the stakes for reliable electronics assembly continue to rise. Every added board, sensor, and control system must perform consistently under demanding conditions.

Indium Highlights Advanced Solder Solutions for Electronics Manufacturing at EFX 2026

09/29/2026 | Indium Corporation
As an industry leader in innovative materials solutions for electronics packaging, Indium Corporation® will showcase its high-reliability solder pastes for PCB assembly and automotive applications at Expo for Electronics Manufacturing (EFX) 2026, October 6-8, in Stuttgart, Germany.

Indium Experts to Present Advanced Packaging, AI, and High-Performance Computing Materials Solutions at IMAPS Symposium

09/28/2026 | Indium Corporation
As a leading provider of high-reliability, AI-enabling soldering materials, three Indium Corporation experts will share new research and insights on addressing advanced packaging and high-power performance challenges at the IMAPS Symposium 2026, September 29-October 1, in Boston, Massachusetts.

TM Soldering Solutions Launches Selective Soldering Process Development Lab

09/22/2026 | TM Soldering Solutions
TM Soldering Solutions, the re-born successor to selective soldering pioneer ACE Production Technologies, announces the opening of a new Selective Soldering Process Development Lab in the company’s Spokane Valley production facility, it is announced.
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