Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Metcal’s Robotic Soldering Wins IPC APEX EXPO Innovation Award
March 1, 2018 | MetcalEstimated reading time: 1 minute
Metcal has been awarded a 2018 IPC APEX EXPO Innovation Award for its Connection Validation (CV) Robotic Soldering System. The award was presented to the company during a Wednesday, February 28, 2018 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. Robotic soldering is becoming more commonplace as manufacturers look to reduce risk and increase productivity.
Metcal’s new CV Robotic Soldering System addresses these needs by combining its patented CV technology with a new Smart Interface System. CV reduces unnecessary dwell time by signalling to the system to move to the next solder joint in the program after a good joint is formed. The Smart Interface System simplifies the programming process by integrating system controls through an easy to use interface.
“We are honored to win the IPC Innovation Award for our Connection Validation Robotic Soldering System,” said Christopher Larocca, President of OK International, which owns Metcal. “Our customers are rapidly adopting robotic soldering equipment as manufacturers look to mitigate risk, increase efficiency and establish production traceability. Our CV Robotic Soldering System addresses these needs by combining its patented CV technology and a new Smart Interface System.”
The IPC APEX EXPO Innovation Awards were established to honor outstanding products and services for the electronics industry. Products and services are reviewed, rated and scored by a panel of industry experts.
About Metcal
Metcal is a benchtop solutions expert that has delivered broad value to customers since its Silicon Valley beginnings in 1982. Offering unrivalled performance, risk mitigation, and ROI, we give electronics manufacturers in automotive, aerospace, medical devices and military sectors the tools—and the confidence—they need to develop faster, safer, more advanced products. Metcal provides advanced technology products across hand soldering, convection rework, fume extraction, and fluid dispensing applications. For more information, click here.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.