Standard of Excellence: Speed vs. Quality in Customer Service
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RTW IPC APEX EXPO: Indium Discusses Fighting Solder Voids
March 6, 2018 | Real Time with...IPCEstimated reading time: Less than a minute
Voiding has increasingly become one of the most critical challenges in the soldering process. In this interview, Christopher Nash, product manager for the PCB assembly solder paste business of Indium, speaks about how the company is helping customers address the voiding challenge.
To watch this interview, click here.
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