Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMTA Europe Electronics in Harsh Environments Conference Preview
March 7, 2018 | Pete Starkey, I-Connect007Estimated reading time: 1 minute
The main event of the 2018 spring program of SMTA Europe will be the Conference in Amsterdam, The Netherlands, on April 24-26, on the theme of Electronics in Harsh Environments.
SMTA Europe Technical Committee member Bob Willis presented a webinar on March 6, in which he was joined by SMTA Europe Chairman Keith Bryant to give a preview of the conference program and some of its highlights.
A video of the webinar can be viewed here.
Bryant explained that the UK-based SMART Group was now fully integrated into SMTA as SMTA Europe, and that the Harsh Environments conference builds on the success of last year’s highly popular SMART/SMTA Contamination, Cleaning and Coating Conference.
This year’s event features leading authorities from the electronics industry and research institutions, and is organised over three days, with the option to attend two professional development courses on April 24: Reliability Assessment of Harsh Environmental Electronics led by Martin Wickham from National Physical Laboratory, and Understanding Shock & Vibration, led by Dr. Alec Feinberg from DfR Software.
The two-day technical program commences on April 25, with sessions on predicting component life, a keynote on high power LED solder joint reliability, with parallel afternoon sessions on reliability of solder alloys and electrochemical reliability on one track, and advanced test methods and adhesion and coating on the other.
The second day’s technical program has morning sessions on automotive environments and high-temperature PCB materials and fabrication. The afternoon features joint SMTA-iNEMI interactive forum with an introductory presentation on the IPC-610 Automotive Addendum followed by a panel discussion on meeting the needs of durability for autonomous vehicle electronics, with breakout groups on designing automotive electronics for use in harsh environments, robustness validation for mission profiles, the zero-defect target for autonomous vehicles, practical sustainability and environmental regulations, and miniaturization and systems integration challenges.
For more information about the conference, click here. The complete program is available here.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.