-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
IPC APEX EXPO Proves a Tremendous Success for Koh Young
March 8, 2018 | IPCEstimated reading time: 2 minutes
On the heels of installing its 11,000th inspection solution at Dynamic Manufacturing, a Matric Group Company, Koh Young experienced its best IPC APEX EXPO. “With more qualified leads than ever before, the Americas market is embracing the leading technologies and solutions we provide to the industry,” said Juan Arango, Managing Director at Koh Young America.
Koh Young demonstrated its 8030-3, the industry’s best-selling SPI (solder paste inspection) system, plus it introduced new features to enhance yields. An example is the 8030-3 with auto repair, which integrates a dispenser to automatically add a measured amount of solder to repair insufficient deposits before the board leaves the machine. Another example was our KSMART Process Optimizer (KPO) that connects the printer to the SPI and enables a closed-loop, print monitoring system powered by the Koh Young AI Platform.
Beyond our new Zenith 2 AOI solution, the show was an ideal opportunity to introduce several platforms for new markets. “I was pleased to see such great excitement about our new KY-P3 pin inspection machine and the Infy, which is designed for machined parts inspection”, said Joel Scutchfield, Americas Sales Manager at Koh Young America. “These products open entirely new markets for us. We are eager to bring these solutions to our customers and help them solve long-standing production quality issues,” concluded Mr. Scutchfield.
Koh Young has been driving toward the smart factory for years and we showed our resolve in several ways at APEX. “Not only did Koh Young proudly participate in the IPC Connected Factory Exchange (CFX) initiative, which allowed attendees to view machine data in real-time on their mobile device, we highlighted numerous ways we can convert the significant amounts of data collected with true 3D measurement into actionable information,” said Brent Fischthal, Sr. Marketing Manager at Koh Young America. “Using the latest artificial intelligence technology, KSMART helps enable the Smart Factory with statistical process control from SPC@KSMART to instant program refinements with OPO@KSMART (Offline Programming Optimizer).” Throughout the show, Koh Young presented how its new AI Platform intelligently applies real-time data to improve the production process.
As IPC APEX Expo concludes, we turn to Semicon China. At the show, Koh Young will highlight its latest innovations for the semiconductor market, including new hardware and software solutions, which drive production and process improvements. We welcome show attendees to visit us in booth 5381 of hall N5 at the Shanghai New International Expo Center during 14-16 March 2018. If you cannot attend the show, you can learn more about Koh Young Technology and its best-in-class inspection solutions click here.
About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, and the United States. These local facilities ensure it maintains close communications with its growing customers base, while providing them with access to a global network of process experts.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.