Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
IPC APEX EXPO Proves a Tremendous Success for Koh Young
March 8, 2018 | IPCEstimated reading time: 2 minutes
On the heels of installing its 11,000th inspection solution at Dynamic Manufacturing, a Matric Group Company, Koh Young experienced its best IPC APEX EXPO. “With more qualified leads than ever before, the Americas market is embracing the leading technologies and solutions we provide to the industry,” said Juan Arango, Managing Director at Koh Young America.
Koh Young demonstrated its 8030-3, the industry’s best-selling SPI (solder paste inspection) system, plus it introduced new features to enhance yields. An example is the 8030-3 with auto repair, which integrates a dispenser to automatically add a measured amount of solder to repair insufficient deposits before the board leaves the machine. Another example was our KSMART Process Optimizer (KPO) that connects the printer to the SPI and enables a closed-loop, print monitoring system powered by the Koh Young AI Platform.
Beyond our new Zenith 2 AOI solution, the show was an ideal opportunity to introduce several platforms for new markets. “I was pleased to see such great excitement about our new KY-P3 pin inspection machine and the Infy, which is designed for machined parts inspection”, said Joel Scutchfield, Americas Sales Manager at Koh Young America. “These products open entirely new markets for us. We are eager to bring these solutions to our customers and help them solve long-standing production quality issues,” concluded Mr. Scutchfield.
Koh Young has been driving toward the smart factory for years and we showed our resolve in several ways at APEX. “Not only did Koh Young proudly participate in the IPC Connected Factory Exchange (CFX) initiative, which allowed attendees to view machine data in real-time on their mobile device, we highlighted numerous ways we can convert the significant amounts of data collected with true 3D measurement into actionable information,” said Brent Fischthal, Sr. Marketing Manager at Koh Young America. “Using the latest artificial intelligence technology, KSMART helps enable the Smart Factory with statistical process control from SPC@KSMART to instant program refinements with OPO@KSMART (Offline Programming Optimizer).” Throughout the show, Koh Young presented how its new AI Platform intelligently applies real-time data to improve the production process.
As IPC APEX Expo concludes, we turn to Semicon China. At the show, Koh Young will highlight its latest innovations for the semiconductor market, including new hardware and software solutions, which drive production and process improvements. We welcome show attendees to visit us in booth 5381 of hall N5 at the Shanghai New International Expo Center during 14-16 March 2018. If you cannot attend the show, you can learn more about Koh Young Technology and its best-in-class inspection solutions click here.
About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, and the United States. These local facilities ensure it maintains close communications with its growing customers base, while providing them with access to a global network of process experts.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.