Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
IPC APEX EXPO Proves a Tremendous Success for Koh Young
March 8, 2018 | IPCEstimated reading time: 2 minutes
On the heels of installing its 11,000th inspection solution at Dynamic Manufacturing, a Matric Group Company, Koh Young experienced its best IPC APEX EXPO. “With more qualified leads than ever before, the Americas market is embracing the leading technologies and solutions we provide to the industry,” said Juan Arango, Managing Director at Koh Young America.
Koh Young demonstrated its 8030-3, the industry’s best-selling SPI (solder paste inspection) system, plus it introduced new features to enhance yields. An example is the 8030-3 with auto repair, which integrates a dispenser to automatically add a measured amount of solder to repair insufficient deposits before the board leaves the machine. Another example was our KSMART Process Optimizer (KPO) that connects the printer to the SPI and enables a closed-loop, print monitoring system powered by the Koh Young AI Platform.
Beyond our new Zenith 2 AOI solution, the show was an ideal opportunity to introduce several platforms for new markets. “I was pleased to see such great excitement about our new KY-P3 pin inspection machine and the Infy, which is designed for machined parts inspection”, said Joel Scutchfield, Americas Sales Manager at Koh Young America. “These products open entirely new markets for us. We are eager to bring these solutions to our customers and help them solve long-standing production quality issues,” concluded Mr. Scutchfield.
Koh Young has been driving toward the smart factory for years and we showed our resolve in several ways at APEX. “Not only did Koh Young proudly participate in the IPC Connected Factory Exchange (CFX) initiative, which allowed attendees to view machine data in real-time on their mobile device, we highlighted numerous ways we can convert the significant amounts of data collected with true 3D measurement into actionable information,” said Brent Fischthal, Sr. Marketing Manager at Koh Young America. “Using the latest artificial intelligence technology, KSMART helps enable the Smart Factory with statistical process control from SPC@KSMART to instant program refinements with OPO@KSMART (Offline Programming Optimizer).” Throughout the show, Koh Young presented how its new AI Platform intelligently applies real-time data to improve the production process.
As IPC APEX Expo concludes, we turn to Semicon China. At the show, Koh Young will highlight its latest innovations for the semiconductor market, including new hardware and software solutions, which drive production and process improvements. We welcome show attendees to visit us in booth 5381 of hall N5 at the Shanghai New International Expo Center during 14-16 March 2018. If you cannot attend the show, you can learn more about Koh Young Technology and its best-in-class inspection solutions click here.
About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, and the United States. These local facilities ensure it maintains close communications with its growing customers base, while providing them with access to a global network of process experts.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.