Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Kulicke & Soffa Further Extends China Presence
March 13, 2018 | Kulicke & Soffa Industries Inc.Estimated reading time: 1 minute
Kulicke & Soffa Industries Inc. has officially opened its China Demo Center in its Suzhou manufacturing facility. K&S Suzhou was established in 2002, spanning over 17,000 square meters, encompasses the company’s equipment software and process engineering, R&D as well as production lines for consumables products such as capillaries, blades and wedge bonding tools.
The 1,200 square meters Demo Center houses a broad assembly line of the latest K&S solutions, including RAPID Pro GEN-S (Smart) Series ball bonder, OptoLux ball bonder for LED and APAMA DA (Die Attach) equipment. Customers can now visit the site for demonstration of the end-to-end surface mount technology (SMT) solution and to develop rapid prototyping setup from screen printing, soldering paste inspection, pick-and-place to automated optical inspection (AOI) systems. Besides the SMT solution, a full assembly line of K&S CMOS Image Sensor (CIS) solution is anticipated to complete in the next few weeks. The new China Demo Center also includes equipment repair and refurbishment facilities.
"The opening of Kulicke and Soffa’s China Demo Center marks another significant milestone for the Company. It further strengthen our strong collaboration with customers and industry partners to develop and drive next-generation packaging solutions in response to the industry's emerging opportunities," said Fusen Chen, Kulicke and Soffa’s President and Chief Executive Officer.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
09/17/2025 | Indium CorporationIndium Corporation President and CEO Ross Berntson will deliver the Electronic Industries Association of India (ELCINA) CEO Forum keynote at Productronica India, to be held September 17-19 in Bengaluru, India.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Naprotek Appoints Mark Crebs to Lead Business Development for Products and Platforms
08/27/2025 | Naprotek LLCNaprotek, LLC, a leading provider of mission-critical electronics technology solutions, announced the appointment of Mark Crebs to Products and Platform Director of Business Development.