Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Kulicke & Soffa Further Extends China Presence
March 13, 2018 | Kulicke & Soffa Industries Inc.Estimated reading time: 1 minute
Kulicke & Soffa Industries Inc. has officially opened its China Demo Center in its Suzhou manufacturing facility. K&S Suzhou was established in 2002, spanning over 17,000 square meters, encompasses the company’s equipment software and process engineering, R&D as well as production lines for consumables products such as capillaries, blades and wedge bonding tools.
The 1,200 square meters Demo Center houses a broad assembly line of the latest K&S solutions, including RAPID Pro GEN-S (Smart) Series ball bonder, OptoLux ball bonder for LED and APAMA DA (Die Attach) equipment. Customers can now visit the site for demonstration of the end-to-end surface mount technology (SMT) solution and to develop rapid prototyping setup from screen printing, soldering paste inspection, pick-and-place to automated optical inspection (AOI) systems. Besides the SMT solution, a full assembly line of K&S CMOS Image Sensor (CIS) solution is anticipated to complete in the next few weeks. The new China Demo Center also includes equipment repair and refurbishment facilities.
"The opening of Kulicke and Soffa’s China Demo Center marks another significant milestone for the Company. It further strengthen our strong collaboration with customers and industry partners to develop and drive next-generation packaging solutions in response to the industry's emerging opportunities," said Fusen Chen, Kulicke and Soffa’s President and Chief Executive Officer.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
ITW EAE to Showcase Latest Electronic Assembly Equipment Developments at productronica
10/21/2025 | ITWITW EAE will be showcasing its latest developments at productronica, November 18-21 in Munich, Germany. The ITW EAE booth A4–554 will have MPM, Camalot, Electrovert, Vitronics Soltec and Despatch applications experts on hand as well as sales and management to answer questions and offer solutions.
PCBA Market Poised to Reach $147.5 Billion by 2035
10/20/2025 | Globe NewswireGlobal printed circuit board assembly market is projected to reach $147.5 billion by 2035, at a CAGR of 4.7% during the forecast period 2025-2035
Precision PCB Acquires Assets of Microplace
10/13/2025 | Precision Technologies Inc.Precision Technologies Inc., doing business as Precision PCB, a One-Stop PCB Fabrication and Assembly services company with 27 years of experience providing Quality, Reliability and Excellence in customer service, has acquired the assets of Microplace, Inc.
ZenaTech Advances Taiwan Facility to Commissioning for NDAA-Compliant Drone Component Production
10/08/2025 | Globe NewswireZenaTech, Inc., a business technology solution provider specializing in AI (Artificial Intelligence) drones, Drone as a Service (DaaS), Enterprise SaaS, and Quantum Computing solutions, announces that its Taipei, Taiwan-based Spider Vision Sensors (SVS) subsidiary has advanced to the commissioning phase and assembly line setup at its recently leased 16,000 square-foot drone components manufacturing facility.
Dymax's New 9773 Ruggedized Adhesive Meets NASA ASTM E595 Low Outgassing
10/07/2025 | DymaxDymax, a leading manufacturer of rapid and light-curing materials and equipment, is pleased to add 9773 ruggedizing and staking adhesive to its portfolio of materials designed for coating, protecting, and securing components on printed circuit boards in satellites, missiles, and space applications.