Powering the Future: How Packaging Choices Make or Break Performance
Nolan’s Notes: Our Spotlight on Europe
Learning with Leo: Interpreting IPC Soldering Requirements and Acceptance Criteria
Sypris Lands Additional Contracts with Harris
March 13, 2018 | Sypris Electronics LLCEstimated reading time: 1 minute
Sypris Electronics LLC, a subsidiary of Sypris Solutions Inc., has recently received multiple contract awards from Harris Corp. to manufacture a variety of mission-critical electronic assemblies for a number of government programs. Terms of the agreements were not disclosed.
The awards from Harris include the production of a variety of electronic assemblies for multiple munition dispensing systems. Awards included systems for the US Navy as well as multiple foreign military programs. Production will begin in 2018.
"This was another important win for Sypris in the DoD sector of our business," said Jim Long, vice president and general manager of Sypris Electronics. "Harris is a leader in this military application and our technical and operational strengths were key to this win. We are honored to have this opportunity to expand our relationship with Harris."
About Sypris Electronics
Sypris Electronics is a trusted provider of electronic solutions, addressing customers’ needs for building complex, mission-critical electronic and electro-mechanical devices and integrated systems. Backed by 50 years of experience, Sypris’ engineering and manufacturing services span our customers’ product life cycle all within a culture of continuous improvement and Six Sigma/Lean thinking. Partners from multiple agencies and tier one companies in Military (DoD), Space, Medical, Civil Avionics, Telecom, and Industrial markets team with Sypris to deliver high-reliability electronics built with strict adherence to regulated requirements. For more information, please visit www.sypriselectronics.com.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Mobix Labs Secures Significant U.S. Navy Tomahawk Missile Component Order as Production Accelerates
03/04/2026 | BUSINESS WIREMobix Labs, Inc., a provider of 5G mmWave, defense, and aerospace components, today announced receipt of a significant production purchase order for components used in the U.S. Navy’s Tomahawk cruise missile program.
Lockheed Martin Demonstrates Next-Gen Command and Control at Lightning Surge 1
01/26/2026 | Lockheed MartinIn collaboration with the 25th Infantry Division (25ID), CPE C3N, multiple U.S. Army stakeholders and several industry partners including Raft and Accelint, Lockheed Martin delivered and successfully demonstrated the first iteration of a Next Generation Command and Control (NGC2) prototype at Lightning Surge 1 (LS1).
Mil Aero High Speed Connectors Market Report 2026: $7.41 Bn Opportunities, Trends, Competitive Landscape, Strategies, and Forecasts, 2020-2025, 2025-2030F, 2035F
01/20/2026 | GlobeNewswireThe Mil Aero High-Speed Connectors Market Global Report 2026 offers strategists, marketers, and senior management the essential data to evaluate this swiftly developing market. The report predicts and analyzes trends that will influence the sector in the next decade and beyond, providing a roadmap to capture emerging opportunities.
Teledyne FLIR Wins $32M Recon Surveillance Contract in Bulgaria
01/15/2026 | BUSINESS WIRETeledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced that it has been awarded a contract by the U.S. Army worth up to $32 million to deliver and integrate advanced electro-optical (EO/IR) systems for the Stryker Infantry Carrier Vehicle (ICV) Recon Kit.
Inside the Fight for U.S. Advanced Packaging: Military Electronics Experts Weigh In
12/15/2025 | I-Connect007 Editorial TeamModern warfare—driven by rapid evolution of UAVs, autonomous systems, and high-speed sensing—has made it clear that U.S. defense electronics must move beyond legacy architectures and embrace UHDI, advanced substrates, and next-generation interconnect technologies. In this roundtable discussion, two defense electronics experts outline a central challenge: The U.S. cannot field high-performance systems or maintain technological advantage while relying on overseas PCB, substrate, and component supply chains.