-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC Volunteers Honored for their Contributions to Industry at IPC APEX EXPO 2018
March 15, 2018 | IPCEstimated reading time: 12 minutes
For their leadership of the 5-33aUT subcommittee in the development of White Paper 021, Considerations of New Classes of Coatings for IPC-CC-830C, Doug Pauls, Rockwell Collins; and Amanda Rickman, Raytheon, earned a committee leadership award.
For his leadership of the 7-31H committee in the development of IPC-HDBK 620, a guidance document for those using IPC-WHMA-A-620 and IPC-D-620, Robert Cooke, NASA Johnson Space Center, earned a committee leadership award. For their significant contributions to the completion of IPC-HDBK 620, Gerald Leslie Bogert, Bechtel Plant Machinery Inc.; Bud Bowen, Winchester Electronics Division; Larry Joy, Amptech, Inc; Sean Keating, Amphenol Limited (UK); Theodore Laser, L-3 Communications; John Tinker, Teledyne Reynolds, earned a special recognition award. For their contributions, James Blanche, NASA Marshall Space Flight Center; Constantino Gonzalez, ACME Training & Consulting; Russell Kido, Practical Components Inc.; Garry McGuire, NASA Marshall Space Flight Center; Randy McNutt, Northrop Grumman Aerospace Systems; Bob Potysman, AssembleTronics, LLC.; Erik Quam, Schlumberger Well Services; Richard Rumas, Honeywell Canada; Sharon Ventress, US Army Aviation & Missile Command, earned a distinguished committee service award.
For their leadership of the D-23 subcommittee in the new revision of IPC-4103B, Specifications for Base Materials for High Speed/High Frequency Applications, Ed Sandor, Taconic Advanced Dielectric Division; and Dan Welch, Rogers Corporation, earned a committee leadership award. For their contributions to the standard revision, Mahendra Gandhi, Northrop Grumman Aerospace Systems; Scott Herrmann, Dupont Circleville; Tony Senese, Panasonic Industrial Devices Sales Company of America (PIDSA); Mamoru (Mark) Takahashi, Asahi Glass Company, Ltd.; Stephen Tisdale, Tisdale Environmental Consulting, LLC.; Chris Totten, Isola Group SARL; Jennet Volden, Rockwell Collins; and David Wynants, Taconic Advanced Dielectric Division, earned a distinguished committee service award.
For their significant contributions to the 2017-2018 IPC APEX EXPO Technical Program Committee, Bev Christian, HDP User Group; Todd MacFadden, Bose Corporation; and Stan Rak, Continental Automotive Systems, earned a special recognition award. For their contributions, Steve Butkovich, Beverley Christian, HDP User Group; Martin Goetz, Northrop Grumman Corp; Dave Hoover, TTM Technologies; Jason Keeping, Celestica; Weifeng Liu, Flextronics; Todd MacFadden, Bose Corporation; Russell Nowland, Nokia; Brook Sandy-Smith, Indium Corporation; Karl Sauter, Oracle America, Inc.; Jeff Schake, ASM Assembly Systems; Julie Silk, Keysight Technologies; Bhanu Sood, NASA Goddard Space Flight Center; and Udo Welzel, Robert Bosch GmbH, earned a distinguished committee service award.
For their leadership of the 2-18b committee that developed IPC-1752A, Amendment 3, Materials Declaration Management Standard, Mark Frimann, Texas Instruments, Inc.; and Aidan Turnbull, BomCheck, earned a committee leadership award. For their significant contributions to this standard, Dr. N Nagaraj, Papros, Inc.; and Jim Kandler, RoHS Ready, LLC, earned a special recognition award. For their contributions, Brenda Baney, B Cubed Consulting; David Carnevale, Dolby Laboratories Forrest Christian, Innovation Machine, Ltd.; Tord Dennis, WSP; Randall Flinders, GreenSoft Technology Inc; Marelle Fogel, DXC; Jason Gooden, Anthesis Group; JB Hollister, Apple, Inc.; Walter Jager, ECD Compliance; Nikki Johnson, Total Parts Plus; Kurk Kan, Bose Corporation; Jim Kandler, RoHS Ready, LLC; Chuck LePard, DXC; Dr. N Nagaraj, Papros, Inc.; Gary Schmalfeld, Raytheon; Eric Straw, Rockwell Collins; Jean-Pierre Theret, Dassault Systemes; Bryan Tran, LSI Logic Corporation; James Vetro, GE Healthcare; Larisa Vishkovetsky, Seagate Technology; Bakul Wadgoankar, Bose Corporation, Tedie West, Siemens; Michael Wurzman, RSJ Technical Consulting; and Michael Zepp, Dassault Systemes, earned a distinguished committee service award.
For their leadership of the 2-18j committee in the development of IPC-1753, Amendment 1, Laboratory Report Standard, Jason Gooden, Anthesis Group; and JB Hollister, Apple, Inc., earned a committee leadership award. For their contributions to IPC-1753, Emma Gates, Intel Corporation; William Haas, Jim Kandler, RoHS Ready, LLC.; Valerie Kuntz, Assent Compliance, Inc.; Chuck LePard, DXC; Dr. N Nagaraj, Papros, Inc.; Stacy Stannard, Bureau Veritas Consumer Products Services; Jean-Pierre Theret, Dassault Systemes; Stephen Tisdale, Tisdale Environmental Consulting, LLC.; Aidan Turnbull, BomCheck; Larisa Vishkovetsky, Seagate Technology; Bakul Wadgaonkar, Bose Corporation; Tedie West, Siemens; Michael Wurzman, RSJ Technical Consulting; Michael Zepp, Dassault Systemes, earned a distinguished committee service award.
For leadership of the D-13 Flexible Circuits Base Materials Subcommittee in the new revision of IPC-4202B, Flexible Base Dielectrics for Use in Flexible Printed Boards, Clark Webster, ALL Flex, LLC., earned a committee leadership award. For their contributions, Michael Collier, Teledyne Advanced Dielectric Solutions; Mark Finstad, Flexible Circuit Technologies, Inc.; Thomas Gardeski, Gemini Sciences, LLC.; Scott Herrmann, Dupont Circleville; Michael Jawitz, Orbital ATK; Nick Koop, TTM Technologies; John Leschisin, Minco Products, Inc.; Mark Seelhammer, Rogers Corporation; Terry Fischer, Hitachi Chemical Company America, Ltd.; Rebecca Steinbauer, ALL Flex, LLC.; and Brent Sweitzer, Multek Flexible Circuits, Inc., earned a distinguished committee service award.
For their leadership of the 5-24c Solder Alloy Task Group that developed Amendment 1 to J-STD-006C, Dave Adams, Rockwell Collins; and Jennie Hwang, H-Technologies Group, earned a committee leadership award. For their contributions, Mahendra Gandhi, Northrop Grumman Aerospace Systems; Renee Michalkiewicz, NTS – Baltimore; Tetsuro Nishimura, Nihon Superior Co., Ltd.; and Brook Sandy-Smith, Indium Corporation, earned a distinguished committee service award.
For their contributions to Printed Electronics standards, Leonard Allison, NTS – Baltimore; Sai Avuthu, Jabil Circuit, Inc.; Neil Bolding, MacDermid Enthone Electronics Solutions; Alan Brown, Engineered Materials Systems, Inc.; Alan Burk, ALMAX; Ken Gann, Lab Tech; Mary Alice Gill, Jabil Circuit, Inc.; Josh Goldberg, Taiyo America Inc.; Scott Gordon, DuPont Teijin Films; Mary Herndon, Raytheon Company; Mike Mastropietro, NextFlex; Jeffrey Parker, Insulectro; Haridoss Sarma, GO 2 Scout 4 R&T; Paul Shaw, In2Tec; Jeff Shubrooks, Raytheon Company; Richard Snogren, Bristlecone, LLC.; Hector Valladares, Honeywell Aerospace; and Steve Vetter, NSWC Crane, earned a distinguished committee service award.
For his leadership of the 7-24 subcommittee that developed IPC-9121 Amendment 1, Michael Carano, RBP Chemical Technology, Inc., earned a committee leadership award. For their contributions, Paul Cooke, TTM Technologies; Happy Holden; and Bhanu Sood, NASA Goddard Space Flight Center, earned a distinguished committee service award.
For his leadership in the development of IPC-7095D, Ray Prasad, Ray Prasad Consultancy Group; and Rob Rowland, Axiom Electronics, LLC., earned a committee leadership award. For their contributions, Dudi Amir, Intel Corporation; Raiyomond Aspandiar, Intel Corporation; Ife Hsu, Intel Corporation; Karen McConnell, Northrop Grumman Corporation; Bhanu Sood, NASA Goddard Space Flight Center; John Thompson, FCI USA, Inc., earned a distinguished committee service award.
Photos from the IPC APEX EXPO committee awards ceremonies as well as the rest of the show are available here.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,300+ member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China. For more information, click here.
Page 2 of 2Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
MacDermid Alpha Electronics Solutions Unveils Unified Global Website to Deepen Customer, Talent, and Stakeholder Engagement
07/31/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, the electronics business of Elements Solutions Inc, today launched macdermidalpha.com - a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide.
KOKI to Showcase Analytical Services and New HF1200 Solder Paste at SMTA Guadalajara 2025
07/31/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, will exhibit at the SMTA Guadalajara Expo & Tech Forum, taking place September 17 & 18, 2025 at Expo Guadalajara, Salón Jalisco Halls D & E in Guadalajara, Mexico.
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.