Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Indium Experts to Speak at Electronics in Harsh Environments Conference
March 15, 2018 | Indium CorporationEstimated reading time: 2 minutes
Two Indium Corporation experts will present at the Electronics in Harsh Environments Conference on April 24-26 in Amsterdam, Netherlands.
Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East will deliver two presentations. Vijay’s first presentation, A Novel Solder Alloy for Service Temperatures of 150–175°C in Automotive Applications, details the performance of a novel SnAgCuSb solder alloy as compared against the Innolot® and SAC305 alloys when reflowed with a standard reflow profile.
Vijay will also present Solder with Engineered Metal Mesh for Improved Bondline Control & Increased Reliability between Substrate and Baseplate in IGBT Modules. This presentation outlines the results of an innovative, drop-in alternative soldering material designed to achieve bondline control on AlSiC baseplates.
Brook Sandy-Smith, PCB Assembly Materials Specialist, will participate in a panel discussion on the Durability for Autonomous Vehicle Electronics – Meeting the Needs as part of the SMTA-iNEMI Interactive Forum.
Vijay is based in the UK and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Vijay is active in several industry organizations, including IMAPS and the Surface Mount Technology Association (SMTA), and has presented at industry forums and conferences internationally. He earned his master’s degree in systems science and industrial engineering from Binghamton University, State University of New York.
Brook Sandy-Smith is a leader in the industry for technical knowledge and support. As a Technical Support Engineer based at Indium Corporation’s Headquarters in Clinton, NY, she specializes in PCB Assembly Materials and works closely with customers to develop custom solutions and optimize their processes. Sandy-Smith has a passion for developing and implementing standardization for test methods, and is an SMTA Certified Process Engineer. She is active in several IPC committees, SMTA programs, and iNEMI projects, currently serving as chair of the J-004 committee and as Vice President of technical programs for the SMTA Empire chapter. Brook graduated from the International Engineering Program at the University of Rhode Island with a degree in Chemical Engineering and German language.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.