-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Henkel Launches Non-Proprietary Solder Paste Analysis Toolkit
March 16, 2018 | HenkelEstimated reading time: 1 minute
Henkel has developed a non-proprietary solder paste analysis toolkit that is easy to implement and targeted at today’s manufacturing complexities, particularly in the printing and reflow process areas.
“As assembly dimensions have dramatically decreased in the last 10 years, the influence of solder paste formulation effectiveness has increased,” explains Doug Dixon, Global Marketing Director at Henkel. “As such, evaluating the many material properties—from print characteristics and stencil behavior to reflow performance and reliability—has become more challenging. The objective of this work was to develop a robust solder paste evaluation tool that integrates current and future market requirements, while providing a simple, off-the-shelf solution for PCB assemblers.”
A cooperative effort between industry specialists in the disciplines of material formulation, statistical evaluation and process engineering, the new solder test vehicle offers a turnkey solder evaluation tool, incorporating PCB design, a complete bill of materials (BOM), full programming documentation, set-up and test methods, and step-by-step directions for a designed experiment.
Considering current and future market requirements, the solder evaluation tool integrates area arrays down to 0.3mm pitch, 0.4mm pitch bottom terminated components (BTCs), and a variety of discretes from 1206s down to 008004s. The unpopulated side of the board offers a design to evaluate slump, spread, solder balling, SIR and print to fail (PTF). Balancing the 22 material properties to be tested along with BOM and labor costs, the PCB and test methods were engineered for efficiency, providing maximum data while minimizing the time investment. A user-defined scorecard that prioritizes various solder paste characteristics and weightings summarizes rating information to indicate the best solder paste for a specific operation.
“There is often hesitance to change solder paste formulations for a variety of reasons,” says Dixon, noting that challenging and time-consuming qualification procedures frequently deter transitioning to a more capable material. “Access to a simple method for determining the best solder material for a particular process enables fast implementation for better yield and reliability outcomes. For assemblers who need or want to update solder formulations on a regular basis, this new test vehicle offers an efficient and effective approach for material qualification.”
The Henkel-developed solder evaluation kit will be available through select, third-party suppliers.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.