-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Cleaning with Data
March 19, 2018 | Barry Matties, I-Connect007Estimated reading time: 7 minutes
During productronica, Tom Forsythe, vice president of KYZEN, spoke to Barry Matties about KYZEN’s new process control monitoring and data service. They discussed the drivers behind these developments, the company’s focus on managing data, and how KYZEN plans to support an industry embracing more cleaning and Industry 4.0.
Barry Matties: Tom, please tell me about this impressive new technology that you’re showing us.
Tom Forsythe: Absolutely. The beginning part, of course, is process control. We’ve been selling process control units for 20-something years. Over the last three or four years we’ve said, “All right, we’ve got these systems, and they’re super robust, very reliable, and very popular, but they’re boring. They’re kind of in the corner, they’re doing their thing, but they’re not really engaging the customer very much.”
We looked into it, and we realized that we were collecting, monitoring, and triggering off loads of data, some of which we saved and some of which we didn’t. We thought, “All right. Let’s review this data experience.” We can collect all this data. We figured out how to blow it up to the cloud in a very attractive, user-defined data visualization sort of mode, and then we started going through the ticks and tacks of it all. What are we actually checking? And, how do we collect this data?
There are either 40 or 50 different data streams, things like the amount of fluid that’s left in the drum, etc., so you don’t have to kick it to see if it’s empty. You can set parameters for any of these variables and get an email or a text alert to tell you that something has hit a warning zone or a stop zone. You don’t have to pay attention, and of course the data is delivered via the cloud, which makes it platform-agnostic; you can see it on your phone, your iPad, and your PC.
So, you have immediate access to that data for in-the-moment operational troubleshooting, or just process review. One of the other value-adders that we’ve gotten back from customers is, “Oh, this is tremendously helpful. That’s all great because we want our system to run well. But what’s even better is when they say, “I got a board back that we made six months ago, and I need to do this audit to prove to the customer that we didn’t do anything wrong. Now I’ve got this tremendous trove of cleaning data that says it is OK to move on to some other part of the process, or there is something wrong with the board.” We weren’t really thinking about that when we put it together; we were more in operational mode. But it’s there, and the software can show the time window and zoom in so you can root around anywhere in the data set for a look back later.
Matties: Is the data service a subscription program? How does that work?
Forsythe: Well, both. At this point, it is a subscription that is included in the package, but we do see this as a subscription having a life of its own down the road. And there are lots of possibilities which are going to be evolving over the course of the next year.
Matties: Let’s back up and just talk a little bit about KYZEN and what you do, and then we’ll connect the dots.
Page 1 of 2
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.