-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
SEHO and Toratec to Demo Selective Solder System at NEPCON China
March 21, 2018 | SEHO Systems GmbHEstimated reading time: 1 minute
SEHO Systems GmbH today announced plans to exhibit at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will demonstrate the SelectLine-C selective soldering system in Stand 1B25 in the German Pavilion.
The SelectLine-C features an outstanding modular design and innovative, award-winning technical details. It allows the integration of additional processes such as selective brushing for automatic cleaning and automated optical inspection for immediate inspection of solder joints directly after the soldering process, thus ensuring clear cost benefits. Highlights for the soldering area are the Synchro software feature to double the production volume without major investments, and the automatic ultrasonic cleaning of solder nozzles that guarantees maximum machine availability and a nozzle service life up to several months.
With hundreds of machine installations throughout the entire range of products, China represents an important market for SEHO. “At SEHO, customers profit from complete solutions with the aim of making production processes more efficient,” says Markus Walter, CEO of SEHO Systems GmbH. This also includes 360° onsite support from solution-driven purchase advice, through process optimization up to complete after sales service. “With Toratec Shanghai we have the perfect partner to provide such service to our customers in China,” explains Walter. Toratec Shanghai has both excellent technical expertise and process knowledge, and can draw on many years of experience to effectively support customers. To keep up with new developments, Toratec’s staff is trained at SEHO’s headquarters in Germany on a regular basis.
For further information, please visit SEHO at NEPCON China, click here.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.