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Alpha to Feature Low-Temp Solder Paste at Texas and New York SMTA Expos
March 29, 2018 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions will be promoting its latest low-temperture technology and updated Reclaim Services materials at the 2018 SMTA Expos being held in Dallas, Texas on April 10 and in Liverpool, New York on April 24.
At the Expos, Alpha will highlight Alpha OM-550, its newest low-temperature solder paste. Officially launched in January 2018, this innovative paste is setting new industry standards for performance and reliability.
Alpha OM-550 was designed to improve drop shock and thermal cycling performance versus existing low temperature alloys. Among its many features, Alpha OM-550 reduces warpage up to 99%, increasing production yields and reducing energy consumption. “The performance of this paste continues to impress us,“ said Robert Wallace, Regional Marketing Manager for the Americas. “Customers are pleased with the efficiencies in both energy and cost in addition to the BGA mechanical reliability, especially when compared to other low temp alloys.“
In addition, Alpha will also feature the recently completed Alpha® Recycling Services Brochure. The brochure outlines the simple processes for electronic assemblers to turn production waste into revenue. Capable of processing all varieties of waste materials, Alpha has the technological edge for maximizing the recycling of solder paste and related solder paste debris, including used jars, dispensers, and stencil cleaning paper. Alpha has the safest, most efficient, environmentally-compliant recycling solutions and takes pride that no materials are ever sent to a landfill.
About SMTA
The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information, click here.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
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12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
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Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
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