The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
iNEMI's PEG Workshop and TWG Kick-Off a Success
March 30, 2018 | iNEMIEstimated reading time: 1 minute
iNEMI’s PEG Workshop and TWG Kick-Off at the recent IPC APEX EXPO 2018 was productive and well attended. Over 40 people participated either in person or through WebEx. Highlights from the PEGs included executive overviews of the situational analyses, key trends and drivers, probable updates to the key product attributes, and needed interactions with others.
Themes from the TWG teams included concepts of eco-design and sustainability throughout manufacturing; ubiquitous sensors and impact to electronic manufacturing in general; thermal management challenges; simulation and modeling use cases to inform the roadmap; the maturing of flexible hybrid electronics; data analytics and security; the changing landscape of packaging; the ecosystem of the semiconductor driver set to include systems as well as devices; the challenges of materials for PCBs; and how pervasive information management has become a solution set in manufacturing.
Smart manufacturing was officially launched as a new TWG for the 2019 effort during the meeting. Each team was asked to provide a graphic of information that flows to and from their team with the other PEGs and TWGs as a start to understand the roadmap as an integrated and multi-dimensional effort. Support from the iNEMI roadmap office includes providing a space to share files easily throughout the process and exploring the best way to present the roadmap information (archival/searchable).
Share on:
Suggested Items
Marcy’s Musings: Countdown—The Fabricator’s Guide to IPC APEX EXPO
02/18/2024 | Marcy LaRont -- Column: Marcy's MusingsLike any great tech industry event, IPC APEX EXPO pushes us out of our busy 24/7 manufacturing bubbles. It forces us to pay attention to things that are important but not always present in our day-to-day lives. But there is so much to see and do. This issue of PCB007 Magazine previews many of the important events taking place at the show this year and highlights some changes and opportunities. Let us help you map out your show plan. This issue is focused on the PCB fabricator’s show experience and how you can get the most from your valuable time and investment in attending the show. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Averatek to Present 'Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs' at IPC APEX EXPO
10/29/2021 | AveratekAveratek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, “Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs” during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California.
IPC APEX EXPO 2022 Attendees Can Achieve Digital Transcendence at Show Networking Events
10/13/2021 | IPCIPC APEX EXPO 2022 attendees can meet with electronics industry innovators and connect with peers all in one place at the San Diego Convention Center, January 22–27, 2022.
Foundations of the Future: IPC Education Foundation Lessons Learned
06/29/2021 | IPC Education Foundation -- Column: Foundations of the FutureLooking back on our second year, the IPC Education Foundation (IPCEF) takes pride in how we how we adjusted our engagement initiatives during the pandemic. We couldn’t rely on our original strategy of hosting and attending a range of in-person activities and events.
Dave Bergman on IPC and CFX
07/03/2018 | Barry Matties, I-Connect007The recent SMT Hybrid Packaging show in Nuremberg, Germany, marked the second opportunity for IPC to showcase its new Connected Factory Exchange (CFX) initiative. In this interview, David Bergman, VP for international relations at IPC, tells us more on the overall reception of CFX and the benefits users are seeing thus far. He also provides an update on what’s next for the open source standard.