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Off Like a Rocket: A Review of the EIPC Summer Conference, Part 1

06/14/2024 | Pete Starkey, I-Connect007
Motorway traffic jams, airport car parking, walking for miles, queuing for security, delayed flights—oh, the joys of travelling. I was quickly reminded of my status as a foreigner while waiting patiently in line for a half-hour at passport control to enter the European Union at Amsterdam Schiphol, having flown all the way from London Luton in the United Kingdom, that great distance of 200 miles. 

IPC Masters 2024 Aims to Enhance Operator Skills in China

06/14/2024 | IPC
To meet the needs of China's electronics industry, IPC Asia and Pudong New Area Association For Quality And Technology Shanghai, will jointly organize a comprehensive skill competition event called IPC Masters 2024 in Shanghai, China.

IPC Hosts Advanced Packaging Symposium in Tokyo

06/13/2024 | IPC
The IPC Advanced Packaging Symposium held in Tokyo on June 7, 2024, brought together leading experts, policy makers and other stakeholders from the semiconductor industry to discuss cutting-edge advancements and collaborative strategies shaping the future of advanced packaging technologies.

IPC Issues Call for Participation for IPC APEX EXPO 2025

06/11/2024 | IPC
IPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2025. The technical conference will be held March 18-20 and professional development courses will take place March 16-17 and 20, 2025 at the Anaheim Convention Center in Anaheim, California.

An IPC ‘Blockbuster’: IPC-7711/21

06/11/2024 | Teresa Rowe, IPC Senior Director, Assembly and Standards Technology
Dan Foster, Missile Defense Agency, has been instrumental in developing IPC-7711/21, Rework, Modification and Repair of Electronics Assemblies, over several revisions of this important guideline document. We talked to Dan and committee member Agnieszka Ozarowski, BAE Systems, about the most recent revision.
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