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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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Elmatica Releases CircuitData Version 1
April 6, 2018 | ElmaticaEstimated reading time: 2 minutes
Elmatica has released Version 1 of CircuitData, an open source solution by which the industry can come together to finally speak a common language for article specification.
“Over my 25-year tenure in the PCB manufacturing and EMS industries, communicating the clear intent of a design to manufacturers has gotten worse, not better, creating incredible frustration and inefficiency in a market that demands speed and reliability. CircuitData is an open source solution by which the industry can come together to finally speak a common language for article specification,” says Judy Warner, director of marketing, community engagement at Altium.
An Addition, Not Replacement
“This language works inside of ODB++ and IPC-2581 and does not replace them. It speaks through computers, not outdated, inefficient PDF files which contain wildly disparate terms that may mean the same thing—or not! CircuitData has opened the door for us to begin speaking the same language and finally communicate crystal clear manufacturing intent. All of this value at no cost, along with an invitation to collaborate industry-wide. CircuitData absolutely has my vote. Industry 4.0 here we come,” says Warner.
Digging Into the Details
Where Version 0.8 was essentially describing the summary of the PCB, Version1 goes into details. It describes every layer and every process. CircuitData was launched last year and has over the months evolved as a complete language thanks to feedback from the PCB industry.
“Feedback, discussions, and questions are crucial for the further development of the language. How we describe layers are a good example of this. We started out with one description, discussed this, and decided that instead of using "layer" on only the conductive layers in a stack up, we use it on pretty much everything. A peelable mask would be a layer, so would the legend and of course, the conductive layers,” says Jan Pedersen, Senior Technical Advisor at Elmatica and Chairman of CircuitData.
Important and Helpful New Additions
Another change in the new version is a new section for processes that take the same approach as layers: Every process is described with its function. Profiles and capabilities are totally rewritten. This makes it possible to create, for example, one profile that would be matched against all layers of a certain function.
“Another hot addition to CircuitData is the implementation of the new material database. Talking about this at IPC APEX EXPO was a true eye opener for several industry experts,” says Pedersen.
CircuitData.org offers a database, primarily designed for developers, that will hold material data relevant to printed circuits. The purpose of the database is to present data from different sources having one generic structure compatible with the CircuitData language.
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Top Business Groups Urge Congress to Extend, Expand Successful Semiconductor Tax Credit
05/14/2026 | SIAThe Semiconductor Industry Association (SIA) and a broad coalition of 17 other top business and trade groups in a letter urged Congress to extend the Advanced Manufacturing Investment Credit (AMIC) – a highly impactful tax credit for chip production that is set to expire at the end of this year – and expand it to cover semiconductor design and other critical R&D activities.
New Courses: Advance Your Electronics Expertise in June and July
05/14/2026 | Global Electronics AssociationStay current with design, manufacturing, and quality standards by enrolling in one of these online instructor-led courses starting in June and July from ElectronicsU at the Global Electronics Association, designed to help professionals at every level sharpen their skills and advance their careers. These live, expert-led sessions combine flexibility with real-time interaction, allowing participants to learn directly from seasoned industry professionals while collaborating with peers worldwide. Access to all applicable IPC standards is included in the courses.
The Journey from Dilution to Zero Liquid Discharge
05/11/2026 | Richard Nichols, GreenSource EngineeringIf you’re familiar with the PCB industry, and a little long in the tooth like me, you may remember the cry, “The water board is here!” (or an equivalent authority). This was the signal for a frantic but regularly rehearsed exercise to turn on all the rinses. This anecdote demonstrates that in the early days of PCB production, prevailing practices revolved around a “dilution is the solution” mentality, in which manufacturers used copious amounts of water to dilute contaminants before discharging them into regulated municipal wastewater systems or natural water bodies.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.