Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
Matrix Reports Success of Next-Gen Dry Film Laminator
April 9, 2018 | Matrix USA Inc.Estimated reading time: 1 minute
Following initial trials and tests, Matrix launched full sales and support of the 630NP laminator in 2016. Today there are over 15 installations throughout North America with another 10-15 scheduled in the next several months.
Fred Long, Equipment Business Development, highlights the 630NP’s capabilities:
The 630NP changes the way dry film is applied to a panel surface to ensure that sub 5 mil features are properly transferred. The innovation is highlighted by its ability to provide EVEN Pressure and Heat across the entire surface of the panel being laminated. It is the only dry film laminator manufactured that addresses the documented problem of older generation machines that were designed in the 1960’s to apply pressure to lamination rolls by squeezing the ends of the roll shafts. The resulting distortion of this traditional method causes low pressure in the middle of the roll making film attachment to the copper surface less than optimum.
In addition, the laminator has been designed to allow for the change of the rubber lamination rolls in seconds. This not only affects productivity but also provides for fast rubber changes to support various surface profiles in all PCB applications; IL, OL, and Flex materials. Matrix now offers a variety of new lamination rolls with different rubber thicknesses and durometers.
Customers continue to report significant yield and productivity increases. In addition, and for the past 45 years, Hakuto has been recognized as providing industry leading reliability to equipment used in the PCB Industry.
One of our valued customers sums up their reasons for acquiring the new Hakuto 630NP Dry Film Laminator, “We are excited about this newest capital investment and continuing our commitment to automating our manufacturing processes. Hakuto laminators have an outstanding reputation for reliability in this industry. The upgrades in this newest model address many of the challenges we face working with ultra-thin materials, multiple copper profiles, film thicknesses and sub 2 mil lines and spaces. The yield increase expected along with the reduced labor and film waste should provide a quick ROI on this investment.”
About Matrix USA Inc.
Committed to the motto, “Quality Products, Dependable People”, Matrix was established in 1977 with the objective of providing quality raw materials to the North American Printed Circuit Board Industry. Matrix has four rapid-response warehouses located throughout the US and Canada that fulfill high quality, fast delivery, and custom orders daily. For further information, click here.
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.