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NUBURU Expands Defense Platform with Laser Arm Targeting Directed-Energy and Counter-UAS Markets

06/05/2026 | BUSINESS WIRE
The Agreement has been signed by NUBURU, Inc., with NUBURU intending to implement the definitive investment and industrial cooperation through Lyocon S.r.l., its Italian laser-engineering and manufacturing subsidiary, as the designated NUBURU group entity.

BOOK EXCERPT: The Printed Circuit Assembler’s Guide to...Design for Test, A Practical Guide to Test and Inspection, Chapter 1

06/04/2026 | I-Connect007
Over the last two to three decades, the electronics industry has experienced a significant transformation. Circuit card assembly (CCA) and printed circuit board (PCB) design have become highly automated and digitized, allowing for faster development and increased design reuse. Engineers can now easily build on existing, proven architectures. Despite these advancements, one key area often falls behind: test and inspection.

AI Data Center Expansion to Push EML and CW-DFB LD Monthly Capacity to 50.7M Units in 2026

06/03/2026 | TrendForce
The rapid expansion of AI data centers and the intensifying race for AI computing power are accelerating the transition toward transmission speeds above 1.6 Tbps, according to TrendForce’s latest research.

The Chemical Connection: The Consequences of Additive Metallizing on Etching Steps

06/01/2026 | Don Ball -- Column: The Chemical Connection
This month, I’m taking another look at additive manufacturing. What does mSAP, SAP, and additive metallizing (plating) look like in today’s advanced PCB fabrication? I must confess I don’t have a lot of insight, as my whole career has been devoted to removing copper from panel surfaces in even and controlled ways, and not to putting copper back on the panel. However, at some point in the additive process, especially in additive plating, copper must be removed from between the conducting surfaces to complete the circuits. Here, I can address some of the consequences of additive metallizing on subsequent etching steps.

IDI Dynamics Debuts High-Speed Laser Marker for Semiconductor OSAT

05/29/2026 | PRNewswire
IDI Dynamics, a subsidiary of ISDN Holdings Limited, has launched its next generation High-speed Laser Marker for semiconductor chip packages, with a dual value proposition of delivering 2.5x higher marking speed and occupying 22% less physical footprint.
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